Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2429) > Сторінка 25 з 41
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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PA0020C | Chip Quik Inc. |
Description: SSOP-28 TO DIP-28 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.050" (1.27mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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PA0020C-N | Chip Quik Inc. |
Description: SSOP-28 TO DIP-28 NARROW SMT ADA Packaging: Bulk Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm) Number of Positions: 28 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 94 шт: термін постачання 21-31 дні (днів) |
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PA0020-S | Chip Quik Inc. |
Description: STENCIL SSOP-28 .65MM Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 28 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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PA0021 | Chip Quik Inc. |
Description: SSOP-30 TO DIP-30 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
товар відсутній |
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PA0021-S | Chip Quik Inc. | Description: SSOP-30 STENCIL |
товар відсутній |
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PA0022 | Chip Quik Inc. |
Description: SSOP-36 TO DIP-36 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0022-S | Chip Quik Inc. | Description: SSOP-36 STENCIL |
товар відсутній |
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PA0023 | Chip Quik Inc. |
Description: SSOP-36 TO DIP-36 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 36 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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PA0023-S | Chip Quik Inc. | Description: SSOP-36 STENCIL |
товар відсутній |
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PA0024 | Chip Quik Inc. |
Description: SSOP-38 TO DIP-38 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
товар відсутній |
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PA0024-S | Chip Quik Inc. | Description: SSOP-38 STENCIL |
товар відсутній |
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PA0025 | Chip Quik Inc. |
Description: SSOP-48 TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: SSOP Part Status: Active |
товар відсутній |
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PA0025-S | Chip Quik Inc. |
Description: SSOP-48 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: SSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
товар відсутній |
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PA0026 | Chip Quik Inc. |
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8 Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP, uMAX, uSOP Part Status: Active |
на замовлення 232 шт: термін постачання 21-31 дні (днів) |
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PA0026C | Chip Quik Inc. |
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: MSOP, uMAX, uSOP Part Status: Active |
на замовлення 109 шт: термін постачання 21-31 дні (днів) |
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PA0026-S | Chip Quik Inc. |
Description: UMAX-8/USOP-8/MSOP-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: uMAX Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
товар відсутній |
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PA0027 | Chip Quik Inc. |
Description: UMAX-10/USOP-10/MSOP-10TODIP-10 Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: MSOP, uMAX, uSOP Part Status: Active |
на замовлення 111 шт: термін постачання 21-31 дні (днів) |
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PA0027C | Chip Quik Inc. |
Description: UMAX-10/USOP-10/MSOP-10 TO DIP-1 Packaging: Bulk Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: MSOP, uMAX, uSOP Part Status: Active |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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PA0027-S | Chip Quik Inc. |
Description: STENCIL MSOP-10 Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: uMAX Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 10 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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PA0028 | Chip Quik Inc. |
Description: QSOP-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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PA0028C | Chip Quik Inc. |
Description: QSOP-16 TO DIP-16 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.025" (0.64mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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PA0028-S | Chip Quik Inc. |
Description: QSOP-16 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.025" (0.64mm) Type: QSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 16 |
товар відсутній |
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PA0029 | Chip Quik Inc. |
Description: QSOP-20 TO DIP-20 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
товар відсутній |
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PA0029C | Chip Quik Inc. |
Description: QSOP-20 TO DIP-20 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Number of Positions: 20 Pitch: 0.025" (0.64mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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PA0029-S | Chip Quik Inc. | Description: QSOP-20 STENCIL |
товар відсутній |
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PA0030 | Chip Quik Inc. |
Description: QSOP-24 TO DIP-24 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 68 шт: термін постачання 21-31 дні (днів) |
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PA0030C | Chip Quik Inc. |
Description: QSOP-24 TO DIP-24 SMT ADAPTER (0 Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Number of Positions: 24 Pitch: 0.025" (0.64mm) Proto Board Type: SMD to DIP Package Accepted: QSOP Part Status: Active |
на замовлення 32 шт: термін постачання 21-31 дні (днів) |
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PA0030-S | Chip Quik Inc. | Description: QSOP-24 STENCIL |
товар відсутній |
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PA0031 | Chip Quik Inc. |
Description: QSOP-28 TO DIP-28 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.025" (0.64mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: QSOP |
товар відсутній |
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PA0031-S | Chip Quik Inc. | Description: QSOP-28 STENCIL |
товар відсутній |
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PA0032 | Chip Quik Inc. |
Description: TSSOP-8 TO DIP-8 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 122 шт: термін постачання 21-31 дні (днів) |
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PA0032C | Chip Quik Inc. |
Description: TSSOP-8 TO DIP-8 SMT ADAPTER (0. Packaging: Bulk Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 8 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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PA0032-S | Chip Quik Inc. |
Description: TSSOP-8 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 8 |
товар відсутній |
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PA0033 | Chip Quik Inc. |
Description: TSSOP-14 TO DIP-14 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 233 шт: термін постачання 21-31 дні (днів) |
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PA0033C | Chip Quik Inc. |
Description: TSSOP-14 TO DIP-14 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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PA0033-S | Chip Quik Inc. |
Description: TSSOP-14 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 14 |
товар відсутній |
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PA0034 | Chip Quik Inc. |
Description: TSSOP-16 TO DIP-16 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 193 шт: термін постачання 21-31 дні (днів) |
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PA0034C | Chip Quik Inc. |
Description: TSSOP-16 TO DIP-16 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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PA0034-S | Chip Quik Inc. |
Description: STENCIL TSSOP-16 .65MM Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 16 |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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PA0035 | Chip Quik Inc. |
Description: TSSOP-20 TO DIP-20 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 107 шт: термін постачання 21-31 дні (днів) |
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PA0035C | Chip Quik Inc. |
Description: TSSOP-20 TO DIP-20 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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PA0035-S | Chip Quik Inc. |
Description: TSSOP-20 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 20 |
товар відсутній |
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PA0036 | Chip Quik Inc. |
Description: TSSOP-24 TO DIP-24 SMT ADAPTER Packaging: Bulk Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 226 шт: термін постачання 21-31 дні (днів) |
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PA0036C | Chip Quik Inc. |
Description: TSSOP-24 TO DIP-24 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 24 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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PA0036C-N | Chip Quik Inc. |
Description: TSSOP-24 TO DIP-24 NARROW SMT AD Packaging: Bulk Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm) Number of Positions: 24 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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PA0036-S | Chip Quik Inc. |
Description: TSSOP-24 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 24 |
товар відсутній |
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PA0037 | Chip Quik Inc. |
Description: TSSOP-28 TO DIP-28 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 61 шт: термін постачання 21-31 дні (днів) |
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PA0037C | Chip Quik Inc. |
Description: TSSOP-28 TO DIP-28 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm) Number of Positions: 28 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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PA0037-S | Chip Quik Inc. |
Description: TSSOP-28 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
товар відсутній |
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PA0038 | Chip Quik Inc. |
Description: TSSOP-30 TO DIP-30 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 30 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
товар відсутній |
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PA0038-S | Chip Quik Inc. | Description: TSSOP-30 STENCIL |
товар відсутній |
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PA0039 | Chip Quik Inc. |
Description: TSSOP-38 TO DIP-38 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 38 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 29 шт: термін постачання 21-31 дні (днів) |
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PA0039C | Chip Quik Inc. |
Description: TSSOP-38 TO DIP-38 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 1.900" L x 0.400" W (48.26mm x 10.16mm) Number of Positions: 38 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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PA0039-S | Chip Quik Inc. | Description: TSSOP-38 STENCIL |
товар відсутній |
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PA0040 | Chip Quik Inc. |
Description: TSSOP-48 TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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PA0040C | Chip Quik Inc. |
Description: TSSOP-48 TO DIP-48 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm) Number of Positions: 48 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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PA0040-S | Chip Quik Inc. |
Description: TSSOP-48 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 48 |
товар відсутній |
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PA0041 | Chip Quik Inc. |
Description: TSSOP-56 TO DIP-56 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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PA0041C | Chip Quik Inc. |
Description: TSSOP-56 TO DIP-56 SMT ADAPTER ( Packaging: Bulk Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm) Number of Positions: 56 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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PA0041-S | Chip Quik Inc. |
Description: TSSOP-56 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 56 |
товар відсутній |
PA0020C |
Виробник: Chip Quik Inc.
Description: SSOP-28 TO DIP-28 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-28 TO DIP-28 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.050" (1.27mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 614.4 грн |
PA0020C-N |
Виробник: Chip Quik Inc.
Description: SSOP-28 TO DIP-28 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-28 TO DIP-28 NARROW SMT ADA
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 94 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 614.4 грн |
PA0020-S |
Виробник: Chip Quik Inc.
Description: STENCIL SSOP-28 .65MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 28
Description: STENCIL SSOP-28 .65MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 28
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 809.99 грн |
PA0021 |
Виробник: Chip Quik Inc.
Description: SSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
PA0022 |
Виробник: Chip Quik Inc.
Description: SSOP-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 495.7 грн |
PA0023 |
Виробник: Chip Quik Inc.
Description: SSOP-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-36 TO DIP-36 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.800" (25.40mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 36
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
на замовлення 45 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 495.7 грн |
PA0024 |
Виробник: Chip Quik Inc.
Description: SSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
PA0025 |
Виробник: Chip Quik Inc.
Description: SSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
Description: SSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: SSOP
Part Status: Active
товар відсутній
PA0025-S |
Виробник: Chip Quik Inc.
Description: SSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: SSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: SSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0026 |
Виробник: Chip Quik Inc.
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
на замовлення 232 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 240.38 грн |
PA0026C |
Виробник: Chip Quik Inc.
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
Description: UMAX-8/USOP-8/MSOP-8 TO DIP-8 SM
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
на замовлення 109 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 447.17 грн |
PA0026-S |
Виробник: Chip Quik Inc.
Description: UMAX-8/USOP-8/MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: uMAX
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: UMAX-8/USOP-8/MSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: uMAX
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
PA0027 |
Виробник: Chip Quik Inc.
Description: UMAX-10/USOP-10/MSOP-10TODIP-10
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
Description: UMAX-10/USOP-10/MSOP-10TODIP-10
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
на замовлення 111 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 282.19 грн |
PA0027C |
Виробник: Chip Quik Inc.
Description: UMAX-10/USOP-10/MSOP-10 TO DIP-1
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
Description: UMAX-10/USOP-10/MSOP-10 TO DIP-1
Packaging: Bulk
Size / Dimension: 0.500" L x 0.400" W (12.70mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: MSOP, uMAX, uSOP
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 495.7 грн |
PA0027-S |
Виробник: Chip Quik Inc.
Description: STENCIL MSOP-10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: uMAX
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 10
Description: STENCIL MSOP-10
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: uMAX
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 10
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 809.99 грн |
PA0028 |
Виробник: Chip Quik Inc.
Description: QSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 58 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 334.45 грн |
PA0028C |
Виробник: Chip Quik Inc.
Description: QSOP-16 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-16 TO DIP-16 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.025" (0.64mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 536.76 грн |
PA0028-S |
Виробник: Chip Quik Inc.
Description: QSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: QSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 16
Description: QSOP-16 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.025" (0.64mm)
Type: QSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 16
товар відсутній
PA0029 |
Виробник: Chip Quik Inc.
Description: QSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
товар відсутній
PA0029C |
Виробник: Chip Quik Inc.
Description: QSOP-20 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-20 TO DIP-20 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 571.1 грн |
PA0030 |
Виробник: Chip Quik Inc.
Description: QSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 68 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 399.4 грн |
PA0030C |
Виробник: Chip Quik Inc.
Description: QSOP-24 TO DIP-24 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
Description: QSOP-24 TO DIP-24 SMT ADAPTER (0
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.025" (0.64mm)
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Part Status: Active
на замовлення 32 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 606.19 грн |
PA0031 |
Виробник: Chip Quik Inc.
Description: QSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
Description: QSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.025" (0.64mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: QSOP
товар відсутній
PA0032 |
Виробник: Chip Quik Inc.
Description: TSSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-8 TO DIP-8 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.400" (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 122 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 220.23 грн |
PA0032C |
Виробник: Chip Quik Inc.
Description: TSSOP-8 TO DIP-8 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-8 TO DIP-8 SMT ADAPTER (0.
Packaging: Bulk
Size / Dimension: 0.400" L x 0.400" W (10.16mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 8
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 42 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 432.99 грн |
PA0032-S |
Виробник: Chip Quik Inc.
Description: TSSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
Description: TSSOP-8 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 8
товар відсутній
PA0033 |
Виробник: Chip Quik Inc.
Description: TSSOP-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-14 TO DIP-14 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 233 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 254.57 грн |
PA0033C |
Виробник: Chip Quik Inc.
Description: TSSOP-14 TO DIP-14 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-14 TO DIP-14 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.700" L x 0.400" W (17.78mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 123 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 461.36 грн |
PA0033-S |
Виробник: Chip Quik Inc.
Description: TSSOP-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
Description: TSSOP-14 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 14
товар відсутній
PA0034 |
Виробник: Chip Quik Inc.
Description: TSSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-16 TO DIP-16 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 193 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 288.91 грн |
PA0034C |
Виробник: Chip Quik Inc.
Description: TSSOP-16 TO DIP-16 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-16 TO DIP-16 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 0.800" L x 0.400" W (20.32mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 61 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 502.42 грн |
PA0034-S |
Виробник: Chip Quik Inc.
Description: STENCIL TSSOP-16 .65MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
Description: STENCIL TSSOP-16 .65MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 16
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 798.79 грн |
PA0035 |
Виробник: Chip Quik Inc.
Description: TSSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-20 TO DIP-20 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 107 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 329.97 грн |
PA0035C |
Виробник: Chip Quik Inc.
Description: TSSOP-20 TO DIP-20 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-20 TO DIP-20 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 56 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 536.76 грн |
PA0035-S |
Виробник: Chip Quik Inc.
Description: TSSOP-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
Description: TSSOP-20 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 20
товар відсутній
PA0036 |
Виробник: Chip Quik Inc.
Description: TSSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-24 TO DIP-24 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 0.700" x 1.200" (17.78mm x 30.48mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 226 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 369.53 грн |
PA0036C |
Виробник: Chip Quik Inc.
Description: TSSOP-24 TO DIP-24 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-24 TO DIP-24 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.200" L x 0.700" W (30.48mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 579.31 грн |
PA0036C-N |
Виробник: Chip Quik Inc.
Description: TSSOP-24 TO DIP-24 NARROW SMT AD
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-24 TO DIP-24 NARROW SMT AD
Packaging: Bulk
Size / Dimension: 1.200" L x 0.400" W (30.48mm x 10.16mm)
Number of Positions: 24
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 44 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 579.31 грн |
PA0036-S |
Виробник: Chip Quik Inc.
Description: TSSOP-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
Description: TSSOP-24 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 24
товар відсутній
PA0037 |
Виробник: Chip Quik Inc.
Description: TSSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-28 TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 61 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 404.62 грн |
PA0037C |
Виробник: Chip Quik Inc.
Description: TSSOP-28 TO DIP-28 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-28 TO DIP-28 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 614.4 грн |
PA0037-S |
Виробник: Chip Quik Inc.
Description: TSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: TSSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товар відсутній
PA0038 |
Виробник: Chip Quik Inc.
Description: TSSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-30 TO DIP-30 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 30
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товар відсутній
PA0039 |
Виробник: Chip Quik Inc.
Description: TSSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-38 TO DIP-38 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 29 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 481.52 грн |
PA0039C |
Виробник: Chip Quik Inc.
Description: TSSOP-38 TO DIP-38 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.900" L x 0.400" W (48.26mm x 10.16mm)
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-38 TO DIP-38 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 1.900" L x 0.400" W (48.26mm x 10.16mm)
Number of Positions: 38
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 681.59 грн |
PA0040 |
Виробник: Chip Quik Inc.
Description: TSSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-48 TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 516.6 грн |
PA0040C |
Виробник: Chip Quik Inc.
Description: TSSOP-48 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-48 TO DIP-48 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 726.38 грн |
PA0040-S |
Виробник: Chip Quik Inc.
Description: TSSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
Description: TSSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0041 |
Виробник: Chip Quik Inc.
Description: TSSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-56 TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 628.58 грн |
PA0041C |
Виробник: Chip Quik Inc.
Description: TSSOP-56 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-56 TO DIP-56 SMT ADAPTER (
Packaging: Bulk
Size / Dimension: 2.800" L x 0.700" W (71.12mm x 17.78mm)
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 838.36 грн |
PA0041-S |
Виробник: Chip Quik Inc.
Description: TSSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
Description: TSSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 56
товар відсутній