Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2568) > Сторінка 37 з 43
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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SMD2032 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2032-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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SMD2036 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2036-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2040 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD2040-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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SMD2050 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD2050-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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SMD2055 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD2055-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2060 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD2060-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2140 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMD2140-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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SMD2150 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2150-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2165 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 43 шт: термін постачання 21-31 дні (днів) |
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SMD2165-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD2170 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD2170-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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SMD2180 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD2180-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2185 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2185-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD2190 | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD2190-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD2195 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2195-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.022" (0.56mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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SMD2200 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD2200-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2205 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD2205-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 123 шт: термін постачання 21-31 дні (днів) |
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SMD2215 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD2215-25000 | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 17 шт: термін постачання 21-31 дні (днів) |
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SMD291 | Chip Quik Inc. |
![]() Packaging: Tube Type: Flux - No Clean, Tacky Solder Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 919 шт: термін постачання 21-31 дні (днів) |
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SMD291-10M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 146 шт: термін постачання 21-31 дні (днів) |
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SMD291150G | Chip Quik Inc. |
![]() Packaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Tacky Solder Form: Jar, 5.29 oz (150g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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SMD29130CC | Chip Quik Inc. |
![]() Packaging: Box Type: Flux - No Clean, Tacky Solder Form: Syringe, 1.06 oz (30g), 30cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 106 шт: термін постачання 21-31 дні (днів) |
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SMD291-5M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 34 шт: термін постачання 21-31 дні (днів) |
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SMD29175G | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Tacky Solder Form: Jar, 2.65 oz (75g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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SMD291AX | Chip Quik Inc. |
![]() Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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SMD291AX10 | Chip Quik Inc. |
![]() Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD291AX10T4 | Chip Quik Inc. |
![]() Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX10T5 | Chip Quik Inc. |
![]() Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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SMD291AX250T3 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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SMD291AX250T4 | Chip Quik Inc. |
![]() Packaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMD291AX250T5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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SMD291AX250T6 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX500T3 | Chip Quik Inc. |
![]() Packaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD291AX500T3C | Chip Quik Inc. |
![]() Packaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMD291AX500T4C | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX500T5 | Chip Quik Inc. |
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товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX500T5C | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX50T3 | Chip Quik Inc. |
![]() Packaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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SMD291AXT4 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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SMD291AXT5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
|
||
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SMD291NL | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 454 шт: термін постачання 21-31 дні (днів) |
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SMD291NL-10M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 83 шт: термін постачання 21-31 дні (днів) |
|
||
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SMD291NL150G | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder Form: Jar, 5.29 oz (150g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD291NL-5M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
|
SMD2032 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 8788.13 грн |
SMD2032-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1972.02 грн |
SMD2036 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 8717.30 грн |
SMD2036-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1896.41 грн |
SMD2040 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .020 DIAM
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .020 DIAM
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 8462.64 грн |
SMD2040-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .020" DIAM
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .020" DIAM
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1692.69 грн |
SMD2050 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD2050-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .024" DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .024" DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1566.95 грн |
SMD2055 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD2055-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 DIAMETER 2
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 DIAMETER 2
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1566.95 грн |
SMD2060 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD2060-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SAC305 .030" DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SAC305 .030" DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1524.77 грн |
SMD2140 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7819.63 грн |
SMD2140-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .008" (
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1668.81 грн |
SMD2150 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7745.62 грн |
SMD2150-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1592.42 грн |
SMD2165 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 43 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7557.01 грн |
SMD2165-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1562.17 грн |
SMD2170 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 6853.51 грн |
SMD2170-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1395.85 грн |
SMD2180 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7157.51 грн |
SMD2180-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1446.78 грн |
SMD2185 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 6852.72 грн |
SMD2185-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1370.38 грн |
SMD2190 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .020 DIAM
Description: SOLDER SPHERES 63/37 .020 DIAM
товару немає в наявності
В кошику
од. на суму грн.
SMD2190-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .020" D
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .020" D
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD2195 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 6229.60 грн |
SMD2195-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1174.62 грн |
SMD2200 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD2200-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .024" D
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .024" D
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1146.76 грн |
SMD2205 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD2205-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .025" D
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .025" D
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 123 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1146.76 грн |
SMD2215 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5643.09 грн |
SMD2215-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .030" D
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .030" D
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 17 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1197.69 грн |
SMD291 |
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Виробник: Chip Quik Inc.
Description: FLUX NO-CLEAN 10CC SYR SMD
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX NO-CLEAN 10CC SYR SMD
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 919 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1115.73 грн |
SMD291-10M |
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Виробник: Chip Quik Inc.
Description: REL0 NO-CLEAN FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: REL0 NO-CLEAN FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 146 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 876.98 грн |
SMD291150G |
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Виробник: Chip Quik Inc.
Description: TACK FLUX 150 GRAM
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 150 GRAM
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 14 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7630.22 грн |
SMD29130CC |
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Виробник: Chip Quik Inc.
Description: TACK FLUX 30CC W/HANDLE & TIP
Packaging: Box
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 30CC W/HANDLE & TIP
Packaging: Box
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 106 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2585.59 грн |
SMD291-5M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 34 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 730.55 грн |
SMD29175G |
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Виробник: Chip Quik Inc.
Description: TACK FLUX 75 GRAM
Packaging: Bulk
Type: Flux - No Clean, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 75 GRAM
Packaging: Bulk
Type: Flux - No Clean, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4571.13 грн |
SMD291AX |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 63/37 5CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO-CLEAN 63/37 5CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1129.25 грн |
SMD291AX10 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 63/37 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO-CLEAN 63/37 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1578.09 грн |
SMD291AX10T4 |
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Виробник: Chip Quik Inc.
Description: SLDR PST NO-CLEAN 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST NO-CLEAN 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD291AX10T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 58 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2256.12 грн |
SMD291AX250T3 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2934.95 грн |
SMD291AX250T4 |
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Виробник: Chip Quik Inc.
Description: SLDR PST NO-CLEAN 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST NO-CLEAN 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3733.94 грн |
SMD291AX250T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 6363.29 грн |
SMD291AX250T6 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 250G (T6) SN
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE IN JAR 250G (T6) SN
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD291AX500T3 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 6044.17 грн |
SMD291AX500T3C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 63/37 T3 5
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO-CLEAN 63/37 T3 5
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 12 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 6044.17 грн |
SMD291AX500T4C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD291AX500T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 500G T5
Description: SOLDER PASTE SN63/PB37 500G T5
товару немає в наявності
В кошику
од. на суму грн.
SMD291AX500T5C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD291AX50T3 |
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Виробник: Chip Quik Inc.
Description: SLDR PASTE NO-CLN SN63/PB37 50G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PASTE NO-CLN SN63/PB37 50G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 979.64 грн |
SMD291AXT4 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 26 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1258.97 грн |
SMD291AXT5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 35 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1538.30 грн |
SMD291NL |
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Виробник: Chip Quik Inc.
Description: FLUX NO-CLEAN LEAD-FREE 5CC SYR
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX NO-CLEAN LEAD-FREE 5CC SYR
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 454 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 836.40 грн |
SMD291NL-10M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 83 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 876.98 грн |
SMD291NL150G |
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Виробник: Chip Quik Inc.
Description: FLUX - NO CLEAN LF CAN 5.29 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - NO CLEAN LF CAN 5.29 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 8071.90 грн |
SMD291NL-5M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 45 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 730.55 грн |