Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2420) > Сторінка 34 з 41
| Фото | Назва | Виробник | Інформація |
Доступність |
Ціна без ПДВ |
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SBB2808-1 | Chip Quik Inc. |
 Description: BREADBOARD GENERAL PURPOSE NPTHPackaging: Bulk Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm) Pitch: 0.100" (2.54mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 3 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) Part Status: Active |
на замовлення 36 шт: термін постачання 21-31 дні (днів) |
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SBB400 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 308 шт: термін постачання 21-31 дні (днів) |
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SBB8006-SS-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE NPTH Packaging: Bulk Size / Dimension: 8.40" L x 4.10" W (213.4mm x 104.1mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Single Side) Plating: Non-Plated Through Hole (NPTH) Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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SBB830 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Both Sides) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 147 шт: термін постачання 21-31 дні (днів) |
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SBB830-QTY10 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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| SBB830-QTY25 | Chip Quik Inc. |
Description: 830 PTS SOLDER-IN BREADBOARD (EX Packaging: Bulk Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: 5 Hole Pad (Single Side) Plating: Plated Through Hole (PTH) |
товар відсутній |
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| SBBSM127P | Chip Quik Inc. |
Description: SMD BREADBOARD 2X2" 1.27MM PITCH Packaging: Bulk Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm) Pitch: 0.050" (1.27mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
на замовлення 77 шт: термін постачання 21-31 дні (днів) |
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SBBSM200P | Chip Quik Inc. |
Description: SMD BREADBOARD 2X2" 2.00MM PITCH Packaging: Bulk Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm) Pitch: 0.079" (2.00mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
на замовлення 110 шт: термін постачання 21-31 дні (днів) |
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SBBSM2106-1 | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMD Packaging: Bulk Size / Dimension: 2.30" L x 0.70" W (58.4mm x 17.8mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pad (Square) Plating: Plated Surface Mount |
на замовлення 364 шт: термін постачання 21-31 дні (днів) |
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| SBBSM2108-1 | Chip Quik Inc. | Description: SMD BREADBOARD 168 SMT PADS |
товар відсутній |
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| SBBSM2112-1 | Chip Quik Inc. |
Description: SMD BREADBOARD 252 SMT PADS Packaging: Bulk Size / Dimension: 2.30" L x 1.30" W (58.4mm x 33.0mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount Part Status: Active |
товар відсутній |
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SBBSM2120-1 | Chip Quik Inc. |
Description: BREADBOARD SMD PLATED SMD Packaging: Bulk Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pad (Square) Plating: Plated Surface Mount |
на замовлення 199 шт: термін постачання 21-31 дні (днів) |
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| SBBSM3030-1 | Chip Quik Inc. | Description: LG SMD BREADBOARD 900 SMT PADS |
товар відсутній |
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| SBBSM3040-1 | Chip Quik Inc. | Description: LG SMD BREADBOARD 1200 SMT PADS |
товар відсутній |
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| SBBSM3050-1 | Chip Quik Inc. |
Description: LG SMD BREADBOARD 1500 SMT PADS Packaging: Bulk Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
товар відсутній |
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| SBBSM3060-1 | Chip Quik Inc. |
Description: LG SMD BREADBOARD 1800 SMT PADS Packaging: Bulk Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
товар відсутній |
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| SBBSM4060-1 | Chip Quik Inc. |
Description: LG SMD BREADBOARD 2400 SMT PADS Packaging: Bulk Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount |
товар відсутній |
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| SBBSM4080-1 | Chip Quik Inc. |
Description: LG SMD BREADBOARD 3200 SMT PADS Packaging: Bulk Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, Surface Mount Circuit Pattern: Pads (Square) Plating: Plated Surface Mount Part Status: Active |
товар відсутній |
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| SBBTH127-254P | Chip Quik Inc. | Description: SOLDER-IN BREADBOARD 2X2" 1.27MM |
товар відсутній |
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| SBBTH127P | Chip Quik Inc. |
Description: SOLDER-IN BREADBOARD 2X2" 1.27MM Packaging: Bulk Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm) Pitch: 0.050" (1.27mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.025" (0.64mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
на замовлення 96 шт: термін постачання 21-31 дні (днів) |
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SBBTH1506-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 1.75" L x 0.70" W (44.5mm x 17.8mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 447 шт: термін постачання 21-31 дні (днів) |
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SBBTH1508-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 1.75" L x 0.90" W (44.5mm x 22.9mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 372 шт: термін постачання 21-31 дні (днів) |
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SBBTH1510-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 1.75" L x 1.10" W (44.5mm x 27.9mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 241 шт: термін постачання 21-31 дні (днів) |
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SBBTH1512-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 1.75" L x 1.30" W (44.5mm x 33.0mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
на замовлення 111 шт: термін постачання 21-31 дні (днів) |
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SBBTH1520-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 2.10" L x 1.75" W (53.3mm x 44.5mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 117 шт: термін постачання 21-31 дні (днів) |
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SBBTH3030-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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SBBTH3040-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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| SBBTH3050-1 | Chip Quik Inc. |
Description: LG SOLDER-IN BREADBOARD 1500 PLA Packaging: Bulk Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
товар відсутній |
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SBBTH3060-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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| SBBTH4060-1 | Chip Quik Inc. |
Description: LG SOLDER-IN BREADBOARD 2400 PLA Packaging: Bulk Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm) Pitch: 0.1" (2.54mm) Grid Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) |
товар відсутній |
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SBBTH4080-1 | Chip Quik Inc. |
Description: BREADBOARD GENERAL PURPOSE PTH Packaging: Bulk Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm) Pitch: 0.100" (2.54mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: Breadboard, General Purpose Hole Diameter: 0.039" (1.00mm) Circuit Pattern: Pad Per Hole (Round) Plating: Plated Through Hole (PTH) Part Status: Active |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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SG1-0.5 | Chip Quik Inc. |
Description: SUPER GLUE - THIN VISCOSITY - PE Packaging: Bulk Features: Fast Cure, 15mL For Use With/Related Products: Multi-Purpose Type: Adhesive |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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SG1-1.0 | Chip Quik Inc. |
Description: SUPER GLUE - THIN VISCOSITY - PE Packaging: Bulk Features: Fast Cure, 30mL For Use With/Related Products: Multi-Purpose Type: Adhesive Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SG2-0.5 | Chip Quik Inc. |
Description: SUPER GLUE - MEDIUM VISCOSITY - Packaging: Bulk Features: Fast Cure, 15mL For Use With/Related Products: Multi-Purpose Type: Adhesive |
на замовлення 96 шт: термін постачання 21-31 дні (днів) |
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SG2-1.0 | Chip Quik Inc. |
Description: SUPER GLUE - MEDIUM VISCOSITY - Features: Fast Cure, 30mL Packaging: Bulk For Use With/Related Products: Multi-Purpose Type: Adhesive |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SG3-0.5 | Chip Quik Inc. |
Description: SUPER GLUE - THICK VISCOSITY - B Packaging: Bulk Features: Fast Cure, 15mL For Use With/Related Products: Multi-Purpose Type: Adhesive |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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SG3-1.0 | Chip Quik Inc. |
Description: SUPER GLUE - THICK VISCOSITY - B Packaging: Bulk Features: Fast Cure, 30mL For Use With/Related Products: Multi-Purpose Type: Adhesive |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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SG4-1.0 | Chip Quik Inc. |
Description: RUBBER REINFORCED SUPER GLUE - F Packaging: Bulk Features: Fast Cure, 30mL For Use With/Related Products: Multi-Purpose Type: Adhesive |
на замовлення 53 шт: термін постачання 21-31 дні (днів) |
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SGF1-4OZ | Chip Quik Inc. |
Description: 4OZ LIQUID ZINC STAINED GLASS SO |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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SGF1-8OZ | Chip Quik Inc. |
Description: 8OZ LIQUID ZINC STAINED GLASS SO |
на замовлення 35 шт: термін постачання 21-31 дні (днів) |
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SGF991-10CC | Chip Quik Inc. |
Description: STAINED GLASS SOLDERING TACKY FL Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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SGF991-30CC | Chip Quik Inc. |
Description: STAINED GLASS SOLDERING TACKY FL |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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SGF991-5CC | Chip Quik Inc. |
Description: STAINED GLASS SOLDERING TACKY FL Packaging: Bulk Type: Flux - Lead Free, Water-Soluble Form: Syringe, 0.176 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 39 шт: термін постачання 21-31 дні (днів) |
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SK0001 | Chip Quik Inc. |
Description: SOIC-8 SOCKET TO DIP-8 ADAPTER ( Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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| SK0002 | Chip Quik Inc. |
Description: SOIC-14 SOCKET TO DIP-14 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
товар відсутній |
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| SK0003 | Chip Quik Inc. |
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
товар відсутній |
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| SK0004 | Chip Quik Inc. |
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
товар відсутній |
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| SK0005 | Chip Quik Inc. |
Description: SOIC-18 SOCKET TO DIP-18 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
товар відсутній |
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| SK0006 | Chip Quik Inc. |
Description: SOIC-20 SOCKET TO DIP-20 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC Part Status: Active |
товар відсутній |
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| SK0007 | Chip Quik Inc. |
Description: SOIC-24 SOCKET TO DIP-24 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC |
товар відсутній |
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| SK0008 | Chip Quik Inc. |
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC |
товар відсутній |
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| SK0009 | Chip Quik Inc. |
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER Packaging: Bulk Module/Board Type: Socket Module - SOIC |
товар відсутній |
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SMD1 | Chip Quik Inc. |
Description: REMOVAL KIT FOR COMPONENTS SMD |
на замовлення 222 шт: термін постачання 21-31 дні (днів) |
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SMD16 | Chip Quik Inc. |
Description: REMOVAL ALLOY 16' SMD Packaging: Tube Accessory Type: Removal Alloy |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD16NL | Chip Quik Inc. |
Description: REMOVAL ALLOY NO-LEAD 16' SMD Packaging: Tube Accessory Type: Removal Alloy |
товар відсутній |
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SMD1NL | Chip Quik Inc. |
Description: REMOVAL KIT LEAD FREE F/COMP SMD |
на замовлення 169 шт: термін постачання 21-31 дні (днів) |
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SMD2000 | Chip Quik Inc. |
Description: SOLDER/DESOLDER REWORK KIT SMD Packaging: Tube Accessory Type: Solder Removal Kit Part Status: Active |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD2016 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2016-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.008" (0.20mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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SMD2020 | Chip Quik Inc. |
Description: SOLDER SPHERES SN96.5/AG3.0/CU0. Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Sphere Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar Process: Lead Free Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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| SBB2808-1 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 4.10" L x 3.20" W (104.1mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 3 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Part Status: Active
на замовлення 36 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 254.78 грн |
| SBB400 |
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Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 3.60" L x 2.30" W (91.4mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 308 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 273.03 грн |
| SBB8006-SS-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 8.40" L x 4.10" W (213.4mm x 104.1mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE NPTH
Packaging: Bulk
Size / Dimension: 8.40" L x 4.10" W (213.4mm x 104.1mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Non-Plated Through Hole (NPTH)
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 922.75 грн |
| SBB830 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Both Sides)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 147 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 443.86 грн |
| SBB830-QTY10 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2514.94 грн |
| SBB830-QTY25 |
Виробник: Chip Quik Inc.
Description: 830 PTS SOLDER-IN BREADBOARD (EX
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Plated Through Hole (PTH)
Description: 830 PTS SOLDER-IN BREADBOARD (EX
Packaging: Bulk
Size / Dimension: 6.60" L x 2.30" W (167.6mm x 58.4mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: 5 Hole Pad (Single Side)
Plating: Plated Through Hole (PTH)
товар відсутній
| SBBSM127P |
Виробник: Chip Quik Inc.
Description: SMD BREADBOARD 2X2" 1.27MM PITCH
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: SMD BREADBOARD 2X2" 1.27MM PITCH
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
на замовлення 77 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 319.75 грн |
| 10+ | 284.5 грн |
| SBBSM200P |
Виробник: Chip Quik Inc.
Description: SMD BREADBOARD 2X2" 2.00MM PITCH
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.079" (2.00mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: SMD BREADBOARD 2X2" 2.00MM PITCH
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.079" (2.00mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
на замовлення 110 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 322.67 грн |
| 10+ | 287.45 грн |
| 100+ | 256.39 грн |
| SBBSM2106-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 0.70" W (58.4mm x 17.8mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 0.70" W (58.4mm x 17.8mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
на замовлення 364 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 108.77 грн |
| SBBSM2112-1 |
Виробник: Chip Quik Inc.
Description: SMD BREADBOARD 252 SMT PADS
Packaging: Bulk
Size / Dimension: 2.30" L x 1.30" W (58.4mm x 33.0mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
Description: SMD BREADBOARD 252 SMT PADS
Packaging: Bulk
Size / Dimension: 2.30" L x 1.30" W (58.4mm x 33.0mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
товар відсутній
| SBBSM2120-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
Description: BREADBOARD SMD PLATED SMD
Packaging: Bulk
Size / Dimension: 2.30" L x 2.10" W (58.4mm x 53.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pad (Square)
Plating: Plated Surface Mount
на замовлення 199 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 286.17 грн |
| SBBSM3050-1 |
Виробник: Chip Quik Inc.
Description: LG SMD BREADBOARD 1500 SMT PADS
Packaging: Bulk
Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: LG SMD BREADBOARD 1500 SMT PADS
Packaging: Bulk
Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
товар відсутній
| SBBSM3060-1 |
Виробник: Chip Quik Inc.
Description: LG SMD BREADBOARD 1800 SMT PADS
Packaging: Bulk
Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: LG SMD BREADBOARD 1800 SMT PADS
Packaging: Bulk
Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
товар відсутній
| SBBSM4060-1 |
Виробник: Chip Quik Inc.
Description: LG SMD BREADBOARD 2400 SMT PADS
Packaging: Bulk
Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Description: LG SMD BREADBOARD 2400 SMT PADS
Packaging: Bulk
Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
товар відсутній
| SBBSM4080-1 |
Виробник: Chip Quik Inc.
Description: LG SMD BREADBOARD 3200 SMT PADS
Packaging: Bulk
Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
Description: LG SMD BREADBOARD 3200 SMT PADS
Packaging: Bulk
Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, Surface Mount
Circuit Pattern: Pads (Square)
Plating: Plated Surface Mount
Part Status: Active
товар відсутній
| SBBTH127P |
Виробник: Chip Quik Inc.
Description: SOLDER-IN BREADBOARD 2X2" 1.27MM
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.025" (0.64mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: SOLDER-IN BREADBOARD 2X2" 1.27MM
Packaging: Bulk
Size / Dimension: 2.00" L x 2.00" W (50.8mm x 50.8mm)
Pitch: 0.050" (1.27mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.025" (0.64mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
на замовлення 96 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 319.75 грн |
| 10+ | 284.5 грн |
| SBBTH1506-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 0.70" W (44.5mm x 17.8mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 0.70" W (44.5mm x 17.8mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 447 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 4+ | 74.46 грн |
| SBBTH1508-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 0.90" W (44.5mm x 22.9mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 0.90" W (44.5mm x 22.9mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 372 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 108.77 грн |
| SBBTH1510-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 1.10" W (44.5mm x 27.9mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 1.10" W (44.5mm x 27.9mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 241 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 3+ | 143.09 грн |
| SBBTH1512-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 1.30" W (44.5mm x 33.0mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 1.75" L x 1.30" W (44.5mm x 33.0mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
на замовлення 111 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 183.97 грн |
| SBBTH1520-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.10" L x 1.75" W (53.3mm x 44.5mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 2.10" L x 1.75" W (53.3mm x 44.5mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 117 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 2+ | 251.86 грн |
| SBBTH3030-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Description: BREADBOARD GENERAL PURPOSE PTH
на замовлення 22 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 559.93 грн |
| SBBTH3040-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Description: BREADBOARD GENERAL PURPOSE PTH
на замовлення 16 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 721.27 грн |
| SBBTH3050-1 |
Виробник: Chip Quik Inc.
Description: LG SOLDER-IN BREADBOARD 1500 PLA
Packaging: Bulk
Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: LG SOLDER-IN BREADBOARD 1500 PLA
Packaging: Bulk
Size / Dimension: 5.10" L x 3.20" W (129.5mm x 81.3mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
товар відсутній
| SBBTH3060-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 6.10" L x 3.20" W (154.9mm x 81.3mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
на замовлення 44 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 977.51 грн |
| SBBTH4060-1 |
Виробник: Chip Quik Inc.
Description: LG SOLDER-IN BREADBOARD 2400 PLA
Packaging: Bulk
Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Description: LG SOLDER-IN BREADBOARD 2400 PLA
Packaging: Bulk
Size / Dimension: 6.10" L x 4.20" W (154.9mm x 106.7mm)
Pitch: 0.1" (2.54mm) Grid
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
товар відсутній
| SBBTH4080-1 |
|
Виробник: Chip Quik Inc.
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
Description: BREADBOARD GENERAL PURPOSE PTH
Packaging: Bulk
Size / Dimension: 8.10" L x 4.20" W (205.7mm x 106.7mm)
Pitch: 0.100" (2.54mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: Breadboard, General Purpose
Hole Diameter: 0.039" (1.00mm)
Circuit Pattern: Pad Per Hole (Round)
Plating: Plated Through Hole (PTH)
Part Status: Active
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1526.49 грн |
| SG1-0.5 |
|
Виробник: Chip Quik Inc.
Description: SUPER GLUE - THIN VISCOSITY - PE
Packaging: Bulk
Features: Fast Cure, 15mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - THIN VISCOSITY - PE
Packaging: Bulk
Features: Fast Cure, 15mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
на замовлення 28 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 400.78 грн |
| SG1-1.0 |
|
Виробник: Chip Quik Inc.
Description: SUPER GLUE - THIN VISCOSITY - PE
Packaging: Bulk
Features: Fast Cure, 30mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Part Status: Active
Description: SUPER GLUE - THIN VISCOSITY - PE
Packaging: Bulk
Features: Fast Cure, 30mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 738.06 грн |
| SG2-0.5 |
|
Виробник: Chip Quik Inc.
Description: SUPER GLUE - MEDIUM VISCOSITY -
Packaging: Bulk
Features: Fast Cure, 15mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - MEDIUM VISCOSITY -
Packaging: Bulk
Features: Fast Cure, 15mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
на замовлення 96 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 400.78 грн |
| SG2-1.0 |
|
Виробник: Chip Quik Inc.
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - MEDIUM VISCOSITY -
Features: Fast Cure, 30mL
Packaging: Bulk
For Use With/Related Products: Multi-Purpose
Type: Adhesive
на замовлення 12 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 738.06 грн |
| SG3-0.5 |
|
Виробник: Chip Quik Inc.
Description: SUPER GLUE - THICK VISCOSITY - B
Packaging: Bulk
Features: Fast Cure, 15mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - THICK VISCOSITY - B
Packaging: Bulk
Features: Fast Cure, 15mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
на замовлення 64 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 400.78 грн |
| SG3-1.0 |
|
Виробник: Chip Quik Inc.
Description: SUPER GLUE - THICK VISCOSITY - B
Packaging: Bulk
Features: Fast Cure, 30mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: SUPER GLUE - THICK VISCOSITY - B
Packaging: Bulk
Features: Fast Cure, 30mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
на замовлення 30 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 738.06 грн |
| SG4-1.0 |
|
Виробник: Chip Quik Inc.
Description: RUBBER REINFORCED SUPER GLUE - F
Packaging: Bulk
Features: Fast Cure, 30mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
Description: RUBBER REINFORCED SUPER GLUE - F
Packaging: Bulk
Features: Fast Cure, 30mL
For Use With/Related Products: Multi-Purpose
Type: Adhesive
на замовлення 53 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 873.11 грн |
| SGF1-4OZ |
|
Виробник: Chip Quik Inc.
Description: 4OZ LIQUID ZINC STAINED GLASS SO
Description: 4OZ LIQUID ZINC STAINED GLASS SO
на замовлення 35 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1148.33 грн |
| 5+ | 1083.87 грн |
| 10+ | 1039.65 грн |
| 25+ | 830.33 грн |
| SGF1-8OZ |
|
Виробник: Chip Quik Inc.
Description: 8OZ LIQUID ZINC STAINED GLASS SO
Description: 8OZ LIQUID ZINC STAINED GLASS SO
на замовлення 35 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1379.02 грн |
| 5+ | 1301.94 грн |
| 10+ | 1248.79 грн |
| 25+ | 997.43 грн |
| SGF991-10CC |
|
Виробник: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 31 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1129.35 грн |
| 5+ | 1065.87 грн |
| 10+ | 1022.36 грн |
| 25+ | 816.56 грн |
| SGF991-30CC |
|
Виробник: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Description: STAINED GLASS SOLDERING TACKY FL
на замовлення 44 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1417.71 грн |
| 5+ | 1338.49 грн |
| 10+ | 1283.94 грн |
| 25+ | 1025.43 грн |
| SGF991-5CC |
|
Виробник: Chip Quik Inc.
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: STAINED GLASS SOLDERING TACKY FL
Packaging: Bulk
Type: Flux - Lead Free, Water-Soluble
Form: Syringe, 0.176 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 39 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 889.9 грн |
| 5+ | 839.65 грн |
| 10+ | 805.34 грн |
| 25+ | 643.24 грн |
| SK0001 |
|
Виробник: Chip Quik Inc.
Description: SOIC-8 SOCKET TO DIP-8 ADAPTER (
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-8 SOCKET TO DIP-8 ADAPTER (
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4111.51 грн |
| SK0002 |
Виробник: Chip Quik Inc.
Description: SOIC-14 SOCKET TO DIP-14 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-14 SOCKET TO DIP-14 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
товар відсутній
| SK0003 |
Виробник: Chip Quik Inc.
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
товар відсутній
| SK0004 |
Виробник: Chip Quik Inc.
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-16 SOCKET TO DIP-16 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
товар відсутній
| SK0005 |
Виробник: Chip Quik Inc.
Description: SOIC-18 SOCKET TO DIP-18 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-18 SOCKET TO DIP-18 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
товар відсутній
| SK0006 |
Виробник: Chip Quik Inc.
Description: SOIC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
Description: SOIC-20 SOCKET TO DIP-20 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Part Status: Active
товар відсутній
| SK0007 |
Виробник: Chip Quik Inc.
Description: SOIC-24 SOCKET TO DIP-24 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-24 SOCKET TO DIP-24 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
товар відсутній
| SK0008 |
Виробник: Chip Quik Inc.
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
товар відсутній
| SK0009 |
Виробник: Chip Quik Inc.
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
Description: SOIC-28 SOCKET TO DIP-28 ADAPTER
Packaging: Bulk
Module/Board Type: Socket Module - SOIC
товар відсутній
| SMD1 |
|
Виробник: Chip Quik Inc.
Description: REMOVAL KIT FOR COMPONENTS SMD
Description: REMOVAL KIT FOR COMPONENTS SMD
на замовлення 222 шт:
термін постачання 21-31 дні (днів)| SMD16 |
|
Виробник: Chip Quik Inc.
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
на замовлення 6 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7154.27 грн |
| SMD16NL |
|
Виробник: Chip Quik Inc.
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY NO-LEAD 16' SMD
Packaging: Tube
Accessory Type: Removal Alloy
товар відсутній
| SMD1NL |
|
Виробник: Chip Quik Inc.
Description: REMOVAL KIT LEAD FREE F/COMP SMD
Description: REMOVAL KIT LEAD FREE F/COMP SMD
на замовлення 169 шт:
термін постачання 21-31 дні (днів)| SMD2000 |
|
Виробник: Chip Quik Inc.
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
Part Status: Active
Description: SOLDER/DESOLDER REWORK KIT SMD
Packaging: Tube
Accessory Type: Solder Removal Kit
Part Status: Active
на замовлення 4 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7852.9 грн |
| SMD2016 |
|
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 7 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 8677.1 грн |
| SMD2016-25000 |
|
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.008" (0.20mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 24 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2049.92 грн |
| SMD2020 |
|
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN96.5/AG3.0/CU0.
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Sphere
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar
Process: Lead Free
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 9194.69 грн |