Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2572) > Сторінка 39 з 43
Фото | Назва | Виробник | Інформація |
Доступність |
Ціна |
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SMD2SWLT.040 10G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 200G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 20G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 50G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.047 1OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free |
на замовлення 6 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.047 2OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free |
на замовлення 19 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.047 4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD32 | Chip Quik Inc. |
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на замовлення 11 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||
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SMD32NL | Chip Quik Inc. |
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на замовлення 11 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||
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SMD3SW.015 100G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 .4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.4 oz (11.34g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD3SW.020 1LB | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 1OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 2OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Shelf Life: 60 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.020 8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 .7OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 21 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 1LB | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 1OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 2OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD3SW.031 8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 20 AWG, 22 SWG Composition: Sn62Pb36Ag2 (62/36/2) Type: Wire Solder Melting Point: 354°F (179°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 100G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 3.53 oz (100g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 10G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.35 oz (10g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 200G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 7 oz (200g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 24 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 20G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 0.7 oz (20g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.040 50G | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.040" (1.02mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1.8 oz (50g) Process: Lead Free Flux Type: No-Clean, Rosin Activated (RA) |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.047 1OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 1 oz (28.35g) Process: Lead Free |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.047 2OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 2 oz (56.70g) Process: Lead Free |
на замовлення 16 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.047 4OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 4 oz (113.40g) Process: Lead Free |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD3SWLT.047 8OZ | Chip Quik Inc. |
![]() Packaging: Bulk Diameter: 0.047" (1.19mm) Composition: Bi58Sn42 (58/42) Type: Wire Solder Melting Point: 280°F (138°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Lead Free |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD4.5 | Chip Quik Inc. |
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на замовлення 17 шт: термін постачання 21-31 дні (днів) |
В кошику од. на суму грн. | ||||||
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SMD4.5NL | Chip Quik Inc. |
![]() Packaging: Tube Accessory Type: Removal Alloy |
на замовлення 42 шт: термін постачання 21-31 дні (днів) |
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SMD4300-10M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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SMD4300150G | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Jar, 5.29 oz (150g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD4300-5M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Syringe, 0.18 oz (5g), 5cc Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 27 шт: термін постачання 21-31 дні (днів) |
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SMD430075G | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Water-Soluble Form: Jar, 2.65 oz (75g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD4300AX10 | Chip Quik Inc. |
![]() Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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SMD4300AX10T4 | Chip Quik Inc. |
![]() Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300AX10T5 | Chip Quik Inc. |
![]() Packaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD4300AX250T3 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 13 шт: термін постачання 21-31 дні (днів) |
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SMD4300AX250T4 | Chip Quik Inc. |
![]() Packaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300AX250T5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300AX500T3C | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300AX500T4C | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300AX500T5C | Chip Quik Inc. |
![]() Packaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
SMD4300LTLFP250T4 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4) Type: Solder Paste Melting Point: 280°F (138°C) Form: Jar, 8.8 oz (250g) Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD4300SNL10 | Chip Quik Inc. |
![]() Packaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 49 шт: термін постачання 21-31 дні (днів) |
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SMD4300SNL10T4 | Chip Quik Inc. |
![]() Packaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300SNL10T5 | Chip Quik Inc. |
![]() Packaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300SNL250T3 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300SNL250T4 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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SMD4300SNL250T5 | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300SNL500T3C | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300SNL500T4C | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean, Water Soluble Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
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SMD4300SNL500T5C | Chip Quik Inc. |
![]() Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean, Water Soluble Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||||||
|
SMD4300TF10 | Chip Quik Inc. |
![]() Packaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Water-Soluble, Liquid Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 605 шт: термін постачання 21-31 дні (днів) |
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SMD4300TF30 | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder, Water Soluble Form: Syringe, 1.06 oz (30g), 30cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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SMD491 | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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SMD491-10M | Chip Quik Inc. |
![]() Packaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 327 шт: термін постачання 21-31 дні (днів) |
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SMD2SWLT.040 10G |
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Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1557.36 грн |
SMD2SWLT.040 200G |
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Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 15296.32 грн |
SMD2SWLT.040 20G |
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Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2673.85 грн |
SMD2SWLT.040 50G |
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Виробник: Chip Quik Inc.
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI57.6/AG0.4 2.2% FLUX CORE
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5735.40 грн |
SMD2SWLT.047 1OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
на замовлення 6 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1224.46 грн |
5+ | 1016.54 грн |
SMD2SWLT.047 2OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
на замовлення 19 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2044.04 грн |
5+ | 1696.28 грн |
10+ | 1591.05 грн |
SMD2SWLT.047 4OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI57.6/AG0.4 .0
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3329.84 грн |
5+ | 2763.38 грн |
SMD32 |
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Виробник: Chip Quik Inc.
Description: INDUSTRIAL PACK 32' SMD
Description: INDUSTRIAL PACK 32' SMD
на замовлення 11 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
SMD32NL |
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Виробник: Chip Quik Inc.
Description: REMOVAL ALLOY NO-LEAD 32' SMD
Description: REMOVAL ALLOY NO-LEAD 32' SMD
на замовлення 11 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
SMD3SW.015 100G |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.015" (0.38mm)
Wire Gauge: 27 AWG, 28 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 3.53 oz (100g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1811.74 грн |
SMD3SW.020 .4OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.4 oz (11.34g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
товару немає в наявності
В кошику
од. на суму грн.
SMD3SW.020 1LB |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5383.69 грн |
SMD3SW.020 1OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1022.43 грн |
SMD3SW.020 2OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1399.50 грн |
SMD3SW.020 4OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Shelf Life: 60 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2206.81 грн |
SMD3SW.020 8OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Wire Gauge: 24 AWG, 25 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3230.87 грн |
SMD3SW.031 .7OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE POCKET PACK 62/36/2
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 21 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Tube, 0.7 oz (19.85g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 592.19 грн |
SMD3SW.031 1LB |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 lb (454 g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5265.91 грн |
SMD3SW.031 1OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 1 oz (28.35g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1000.34 грн |
SMD3SW.031 2OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 2 oz (56.70g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1369.23 грн |
SMD3SW.031 4OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 4 oz (113.40g)
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 8 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2159.36 грн |
SMD3SW.031 8OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Description: SOLDER WIRE 62/36/2 TIN/LEAD/SIL
Packaging: Bulk
Diameter: 0.031" (0.79mm)
Wire Gauge: 20 AWG, 22 SWG
Composition: Sn62Pb36Ag2 (62/36/2)
Type: Wire Solder
Melting Point: 354°F (179°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3159.71 грн |
SMD3SWLT.040 100G |
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Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 3.53 oz (100g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 9205.93 грн |
SMD3SWLT.040 10G |
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Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.35 oz (10g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1502.56 грн |
SMD3SWLT.040 200G |
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Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 7 oz (200g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 24 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 14818.64 грн |
SMD3SWLT.040 20G |
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Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 0.7 oz (20g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2573.24 грн |
SMD3SWLT.040 50G |
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Виробник: Chip Quik Inc.
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
Description: SN42/BI58 2.2% FLUX CORE SOLDER
Packaging: Bulk
Diameter: 0.040" (1.02mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1.8 oz (50g)
Process: Lead Free
Flux Type: No-Clean, Rosin Activated (RA)
на замовлення 2 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5523.56 грн |
SMD3SWLT.047 1OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 1OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 1OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 1 oz (28.35g)
Process: Lead Free
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1095.22 грн |
5+ | 908.31 грн |
10+ | 851.76 грн |
SMD3SWLT.047 2OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 2OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 2OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 2 oz (56.70g)
Process: Lead Free
на замовлення 16 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1347.97 грн |
5+ | 1271.42 грн |
10+ | 1219.59 грн |
SMD3SWLT.047 4OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 4OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 4OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 4 oz (113.40g)
Process: Lead Free
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3221.05 грн |
SMD3SWLT.047 8OZ |
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Виробник: Chip Quik Inc.
Description: SOLDER WIRE SN42/BI58 .047" 8OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
Description: SOLDER WIRE SN42/BI58 .047" 8OZ
Packaging: Bulk
Diameter: 0.047" (1.19mm)
Composition: Bi58Sn42 (58/42)
Type: Wire Solder
Melting Point: 280°F (138°C)
Form: Spool, 8 oz (227g), 1/2 lb
Process: Lead Free
на замовлення 3 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 5249.55 грн |
SMD4.5 |
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Виробник: Chip Quik Inc.
Description: REMOVAL ALLOY 4.5' LEADED
Description: REMOVAL ALLOY 4.5' LEADED
на замовлення 17 шт:
термін постачання 21-31 дні (днів)В кошику од. на суму грн.
SMD4.5NL |
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Виробник: Chip Quik Inc.
Description: REMOVAL ALLOY 4.5' LEAD FREE
Packaging: Tube
Accessory Type: Removal Alloy
Description: REMOVAL ALLOY 4.5' LEAD FREE
Packaging: Tube
Accessory Type: Removal Alloy
на замовлення 42 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2565.06 грн |
SMD4300-10M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN WATER-WASH FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN WATER-WASH FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 18 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 901.37 грн |
SMD4300150G |
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Виробник: Chip Quik Inc.
Description: FLUX - WATER SOLUBLE CAN 5.92OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - WATER SOLUBLE CAN 5.92OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 8584.29 грн |
SMD4300-5M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN WATER-WASHABLE W/ TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN WATER-WASHABLE W/ TIPS
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Syringe, 0.18 oz (5g), 5cc
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 27 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 776.23 грн |
SMD430075G |
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Виробник: Chip Quik Inc.
Description: FLUX - WATER SOLUBLE CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - WATER SOLUBLE CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Water-Soluble
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4905.19 грн |
SMD4300AX10 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE WATER SOL 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE WATER SOL 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1877.18 грн |
SMD4300AX10T4 |
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Виробник: Chip Quik Inc.
Description: SLDR PST WATR SOL 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST WATR SOL 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300AX10T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE WATER SOL T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE WATER SOL T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 2449.73 грн |
SMD4300AX250T3 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 13 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3088.55 грн |
SMD4300AX250T4 |
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Виробник: Chip Quik Inc.
Description: SLDR PST WATR SOL 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST WATR SOL 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300AX250T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300AX500T3C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T3 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T3 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300AX500T4C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300AX500T5C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300LTLFP250T4 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN42/BI57.6/AG0.4
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SN42/BI57.6/AG0.4
Packaging: Bulk
Composition: Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Type: Solder Paste
Melting Point: 280°F (138°C)
Form: Jar, 8.8 oz (250g)
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 32°F ~ 77°F (0°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 7984.74 грн |
SMD4300SNL10 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE WATER SOL LF 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE WATER SOL LF 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 49 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1940.97 грн |
SMD4300SNL10T4 |
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Виробник: Chip Quik Inc.
Description: SLDR PST WATR SOL SAC305 T4 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PST WATR SOL SAC305 T4 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300SNL10T5 |
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Виробник: Chip Quik Inc.
Description: SLD PASTE LF WATER SOL T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLD PASTE LF WATER SOL T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300SNL250T3 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300SNL250T4 |
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Виробник: Chip Quik Inc.
Description: SLDR PST WATR SOL SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PST WATR SOL SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 30 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 4736.70 грн |
SMD4300SNL250T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300SNL500T3C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T3 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T3 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300SNL500T4C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300SNL500T5C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T5 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T5 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean, Water Soluble
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
SMD4300TF10 |
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Виробник: Chip Quik Inc.
Description: TACK FLUX 10CC WATER WASHABLE
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Water-Soluble, Liquid
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 10CC WATER WASHABLE
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Water-Soluble, Liquid
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 605 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1290.71 грн |
SMD4300TF30 |
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Виробник: Chip Quik Inc.
Description: TACK FLUX IN 30CC SYRINGE NO-CLE
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder, Water Soluble
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX IN 30CC SYRINGE NO-CLE
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder, Water Soluble
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 3014.11 грн |
SMD491 |
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Виробник: Chip Quik Inc.
Description: NC HALOGEN-FREE TACK FLUX 10CC
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NC HALOGEN-FREE TACK FLUX 10CC
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 22 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 1932.80 грн |
5+ | 1603.18 грн |
10+ | 1503.15 грн |
SMD491-10M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN HALOGEN-FREE FLUX W/TIP
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN HALOGEN-FREE FLUX W/TIP
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 327 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна |
---|---|
1+ | 901.37 грн |