Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2702) > Сторінка 39 з 46
| Фото | Назва | Виробник | Інформація | Доступність | Ціна без ПДВ | ||
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SMD2150 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .010" (Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2150-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .010" (Packaging: Bulk Diameter: 0.010" (0.25mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD2165 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .012 DIAMPackaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD2165-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .012" DPackaging: Bulk Diameter: 0.012" (0.31mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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SMD2170 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .014" (Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2170-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .014" (Packaging: Bulk Diameter: 0.014" (0.36mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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SMD2180 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .016" (Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD2180-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .016" (Packaging: Bulk Diameter: 0.016" (0.40mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 31 шт: термін постачання 21-31 дні (днів) |
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SMD2185 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .018" (Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 5 шт: термін постачання 21-31 дні (днів) |
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SMD2185-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .018" (Packaging: Bulk Diameter: 0.018" (0.46mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 22 шт: термін постачання 21-31 дні (днів) |
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SMD2190 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .020 DIAM |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD2190-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .020" DPackaging: Bulk Diameter: 0.020" (0.51mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 63 шт: термін постачання 21-31 дні (днів) |
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SMD2195 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .022" (Packaging: Bulk Diameter: 0.022" (0.56mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD2195-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .022" (Packaging: Bulk Diameter: 0.022" (0.56mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 30 шт: термін постачання 21-31 дні (днів) |
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SMD2200 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .024 DIAMPackaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 26 шт: термін постачання 21-31 дні (днів) |
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SMD2200-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .024" DPackaging: Bulk Diameter: 0.024" (0.61mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 101 шт: термін постачання 21-31 дні (днів) |
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SMD2205 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .025 DIAMPackaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD2205-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .025" DPackaging: Bulk Diameter: 0.025" (0.64mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 145 шт: термін постачання 21-31 дні (днів) |
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SMD2210-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .0256"Packaging: Bulk Diameter: 0.256" (6.50mm) Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Process: Leaded Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD2215 | Chip Quik Inc. |
Description: SOLDER SPHERES 63/37 .030 DIAMPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD2215-25000 | Chip Quik Inc. |
Description: SOLDER SPHERES SN63/PB37 .030" DPackaging: Bulk Diameter: 0.030" (0.76mm) Composition: Sn63Pb37 (63/37) Type: Solder Sphere Melting Point: 361°F (183°C) Form: Jar Process: Leaded Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 102 шт: термін постачання 21-31 дні (днів) |
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SMD291 | Chip Quik Inc. |
Description: FLUX NO-CLEAN 10CC SYR SMDPackaging: Tube Type: Flux - No Clean, Tacky Solder Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 2890 шт: термін постачання 21-31 дні (днів) |
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SMD291-10M | Chip Quik Inc. |
Description: REL0 NO-CLEAN FLUX W/ TIPSPackaging: Bulk Type: Flux - No Clean Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 525 шт: термін постачання 21-31 дні (днів) |
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SMD291150G | Chip Quik Inc. |
Description: TACK FLUX 150 GRAMPackaging: Bulk Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. Type: Flux - No Clean, Tacky Solder Form: Jar, 5.29 oz (150g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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SMD29130CC | Chip Quik Inc. |
Description: TACK FLUX 30CC W/HANDLE & TIPPackaging: Box Type: Flux - No Clean, Tacky Solder Form: Syringe, 1.06 oz (30g), 30cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 195 шт: термін постачання 21-31 дні (днів) |
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SMD291-5M | Chip Quik Inc. |
Description: NO-CLEAN TACK FLUX W/ TIPSPackaging: Bulk Type: Flux - No Clean Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 262 шт: термін постачання 21-31 дні (днів) |
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SMD29175G | Chip Quik Inc. |
Description: TACK FLUX 75 GRAMPackaging: Bulk Type: Flux - No Clean, Tacky Solder Form: Jar, 2.65 oz (75g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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SMD291AX | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN 63/37 5CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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SMD291AX10 | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN 63/37 10CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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SMD291AX10T4 | Chip Quik Inc. |
Description: SLDR PST NO-CLEAN 63/37 T4 10CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX10T5 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN T5 10CCPackaging: Syringe Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 58 шт: термін постачання 21-31 дні (днів) |
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SMD291AX250T3 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 250GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 4 шт: термін постачання 21-31 дні (днів) |
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SMD291AX250T4 | Chip Quik Inc. |
Description: SLDR PST NO-CLEAN 63/37 T4 250GPackaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMD291AX250T5 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 250G T5Packaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 28 шт: термін постачання 21-31 дні (днів) |
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SMD291AX250T6 | Chip Quik Inc. |
Description: SOLDER PASTE IN JAR 250G (T6) SNPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 8.8 oz (250g) Process: Leaded Flux Type: No-Clean Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX500T3 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 500GPackaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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SMD291AX500T3C | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN 63/37 T3 5Packaging: Cartridge Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 12 шт: термін постачання 21-31 дні (днів) |
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SMD291AX500T4C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T4 500GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX500T5 | Chip Quik Inc. |
Description: SOLDER PASTE SN63/PB37 500G T5 |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX500T5C | Chip Quik Inc. |
Description: SOLDER PASTE 63/37 T5 500GPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 5 Process: Leaded Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291AX50T3 | Chip Quik Inc. |
Description: SLDR PASTE NO-CLN SN63/PB37 50GPackaging: Jar Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Jar, 1.76 oz (50g) Mesh Type: 3 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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SMD291AXT4 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN 63SN/37PBPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 4 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 178 шт: термін постачання 21-31 дні (днів) |
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SMD291AXT5 | Chip Quik Inc. |
Description: SOLDER PASTE NO CLEAN 63SN/37PBPackaging: Bulk Composition: Sn63Pb37 (63/37) Type: Solder Paste Melting Point: 361°F (183°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 5 Process: Leaded Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 12 Months |
на замовлення 102 шт: термін постачання 21-31 дні (днів) |
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SMD291NL | Chip Quik Inc. |
Description: FLUX NO-CLEAN LEAD-FREE 5CC SYRPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 3330 шт: термін постачання 21-31 дні (днів) |
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SMD291NL-10M | Chip Quik Inc. |
Description: NO-CLEAN TACK FLUX W/TIPSPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.35 oz (10g), 10cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 299 шт: термін постачання 21-31 дні (днів) |
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SMD291NL150G | Chip Quik Inc. |
Description: FLUX - NO CLEAN LF CAN 5.29 OZPackaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder Form: Jar, 5.29 oz (150g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 2 шт: термін постачання 21-31 дні (днів) |
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SMD291NL-5M | Chip Quik Inc. |
Description: NO-CLEAN TACK FLUX W/TIPSPackaging: Bulk Type: Flux - No Clean, Lead Free Form: Syringe, 0.18 oz (5g), 5cc Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 154 шт: термін постачання 21-31 дні (днів) |
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SMD291NL75G | Chip Quik Inc. |
Description: FLUX - NO CLEAN LF CAN 2.64 OZPackaging: Bulk Type: Flux - No Clean, Lead Free, Tacky Solder Form: Jar, 2.65 oz (75g) Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 10 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN LF 5CC SYRPackaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 0.53 oz (15g), 5cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 157 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL10 | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN 10CC SYRPackaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL10T5 | Chip Quik Inc. |
Description: SOLDER PASTE LF T5 10CCPackaging: Dispenser Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Syringe, 1.23 oz (35g), 10cc Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 45 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL15T4 | Chip Quik Inc. |
Description: SOLDER PASTE TWO PART MIXPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste, Two Part Mix Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 0.53 oz (15g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C) Shelf Life Start: Date of Manufacture Shelf Life: 24 Months |
на замовлення 14 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL250T3 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T3Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 56 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL250T4 | Chip Quik Inc. |
Description: SLDR PST NO-CLEAN SAC305 T4 250GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 3 шт: термін постачання 21-31 дні (днів) |
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SMD291SNL250T5 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 250G T5Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 8.8 oz (250g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291SNL40T7 | Chip Quik Inc. |
Description: SOLDER PASTE IN JAR 40G (T7) SACPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 1.41 oz (40g) Mesh Type: 7 Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291SNL500T3 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 500GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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SMD291SNL500T3C | Chip Quik Inc. |
Description: SOLDER PASTE NO-CLEAN SAC305 T3Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 3 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
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SMD291SNL500T4C | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 T4 500GPackaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Cartridge, 17.64 oz (500g) Mesh Type: 4 Process: Lead Free Flux Type: No-Clean Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
товару немає в наявності |
В кошику од. на суму грн. | ||
|
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SMD291SNL500T5 | Chip Quik Inc. |
Description: SOLDER PASTE SAC305 500G T5Packaging: Bulk Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Solder Paste Melting Point: 423 ~ 428°F (217 ~ 220°C) Form: Jar, 17.64 oz (500g) Mesh Type: 5 Process: Lead Free Flux Type: No-Clean Part Status: Active Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C) Shelf Life Start: Date of Manufacture Shelf Life: 6 Months |
на замовлення 8 шт: термін постачання 21-31 дні (днів) |
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| SMD2150 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7507.26 грн |
| SMD2150-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .010" (
Packaging: Bulk
Diameter: 0.010" (0.25mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1419.23 грн |
| SMD2165 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .012 DIAM
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6960.39 грн |
| SMD2165-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .012" D
Packaging: Bulk
Diameter: 0.012" (0.31mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 22 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1382.98 грн |
| SMD2170 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6472.15 грн |
| SMD2170-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .014" (
Packaging: Bulk
Diameter: 0.014" (0.36mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 23 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1317.41 грн |
| SMD2180 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6203.73 грн |
| SMD2180-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .016" (
Packaging: Bulk
Diameter: 0.016" (0.40mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 31 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1254.17 грн |
| SMD2185 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 5 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6047.15 грн |
| SMD2185-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .018" (
Packaging: Bulk
Diameter: 0.018" (0.46mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 22 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1187.83 грн |
| SMD2190 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .020 DIAM
Description: SOLDER SPHERES 63/37 .020 DIAM
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5832.72 грн |
| SMD2190-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .020" D
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .020" D
Packaging: Bulk
Diameter: 0.020" (0.51mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 63 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1146.18 грн |
| SMD2195 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6037.89 грн |
| SMD2195-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .022" (
Packaging: Bulk
Diameter: 0.022" (0.56mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 30 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1100.67 грн |
| SMD2200 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .024 DIAM
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 26 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 10632.65 грн |
| SMD2200-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .024" D
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .024" D
Packaging: Bulk
Diameter: 0.024" (0.61mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 101 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1511.02 грн |
| SMD2205 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .025 DIAM
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD2205-25000 |
![]() |
Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .025" D
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .025" D
Packaging: Bulk
Diameter: 0.025" (0.64mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 145 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1465.51 грн |
| SMD2210-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .0256"
Packaging: Bulk
Diameter: 0.256" (6.50mm)
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .0256"
Packaging: Bulk
Diameter: 0.256" (6.50mm)
Composition: Sn63Pb37 (63/37)
Type: Wire Solder
Melting Point: 361°F (183°C)
Process: Leaded
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD2215 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES 63/37 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES 63/37 .030 DIAM
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5469.43 грн |
| SMD2215-25000 |
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Виробник: Chip Quik Inc.
Description: SOLDER SPHERES SN63/PB37 .030" D
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER SPHERES SN63/PB37 .030" D
Packaging: Bulk
Diameter: 0.030" (0.76mm)
Composition: Sn63Pb37 (63/37)
Type: Solder Sphere
Melting Point: 361°F (183°C)
Form: Jar
Process: Leaded
Part Status: Active
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 102 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1648.31 грн |
| SMD291 |
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Виробник: Chip Quik Inc.
Description: FLUX NO-CLEAN 10CC SYR SMD
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX NO-CLEAN 10CC SYR SMD
Packaging: Tube
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 2890 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1052.85 грн |
| SMD291-10M |
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Виробник: Chip Quik Inc.
Description: REL0 NO-CLEAN FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: REL0 NO-CLEAN FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 525 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 789.06 грн |
| SMD291150G |
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Виробник: Chip Quik Inc.
Description: TACK FLUX 150 GRAM
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 150 GRAM
Packaging: Bulk
Shipping Info: Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Type: Flux - No Clean, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 21 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7010.53 грн |
| SMD29130CC |
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Виробник: Chip Quik Inc.
Description: TACK FLUX 30CC W/HANDLE & TIP
Packaging: Box
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 30CC W/HANDLE & TIP
Packaging: Box
Type: Flux - No Clean, Tacky Solder
Form: Syringe, 1.06 oz (30g), 30cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 195 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2439.69 грн |
| SMD291-5M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/ TIPS
Packaging: Bulk
Type: Flux - No Clean
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 262 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 657.16 грн |
| SMD29175G |
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Виробник: Chip Quik Inc.
Description: TACK FLUX 75 GRAM
Packaging: Bulk
Type: Flux - No Clean, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: TACK FLUX 75 GRAM
Packaging: Bulk
Type: Flux - No Clean, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4313.22 грн |
| SMD291AX |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 63/37 5CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO-CLEAN 63/37 5CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 25 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1094.50 грн |
| SMD291AX10 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 63/37 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO-CLEAN 63/37 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1529.53 грн |
| SMD291AX10T4 |
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Виробник: Chip Quik Inc.
Description: SLDR PST NO-CLEAN 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST NO-CLEAN 63/37 T4 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD291AX10T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN T5 10CC
Packaging: Syringe
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 58 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2186.69 грн |
| SMD291AX250T3 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 4 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2829.20 грн |
| SMD291AX250T4 |
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Виробник: Chip Quik Inc.
Description: SLDR PST NO-CLEAN 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PST NO-CLEAN 63/37 T4 250G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 3619.03 грн |
| SMD291AX250T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 250G T5
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 28 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 6158.99 грн |
| SMD291AX250T6 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 250G (T6) SN
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE IN JAR 250G (T6) SN
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 8.8 oz (250g)
Process: Leaded
Flux Type: No-Clean
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD291AX500T3 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE SN63/PB37 500G
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 1 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5858.18 грн |
| SMD291AX500T3C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 63/37 T3 5
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO-CLEAN 63/37 T3 5
Packaging: Cartridge
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 12 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 5858.18 грн |
| SMD291AX500T4C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T4 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD291AX500T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SN63/PB37 500G T5
Description: SOLDER PASTE SN63/PB37 500G T5
товару немає в наявності
В кошику
од. на суму грн.
| SMD291AX500T5C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE 63/37 T5 500G
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD291AX50T3 |
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Виробник: Chip Quik Inc.
Description: SLDR PASTE NO-CLN SN63/PB37 50G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SLDR PASTE NO-CLN SN63/PB37 50G
Packaging: Jar
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Jar, 1.76 oz (50g)
Mesh Type: 3
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 21 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 949.50 грн |
| SMD291AXT4 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 4
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 178 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1218.69 грн |
| SMD291AXT5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
Description: SOLDER PASTE NO CLEAN 63SN/37PB
Packaging: Bulk
Composition: Sn63Pb37 (63/37)
Type: Solder Paste
Melting Point: 361°F (183°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 5
Process: Leaded
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 12 Months
на замовлення 102 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1452.40 грн |
| SMD291NL |
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Виробник: Chip Quik Inc.
Description: FLUX NO-CLEAN LEAD-FREE 5CC SYR
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX NO-CLEAN LEAD-FREE 5CC SYR
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 3330 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 789.06 грн |
| SMD291NL-10M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.35 oz (10g), 10cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 299 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 789.06 грн |
| SMD291NL150G |
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Виробник: Chip Quik Inc.
Description: FLUX - NO CLEAN LF CAN 5.29 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - NO CLEAN LF CAN 5.29 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 5.29 oz (150g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 2 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 7270.46 грн |
| SMD291NL-5M |
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Виробник: Chip Quik Inc.
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: NO-CLEAN TACK FLUX W/TIPS
Packaging: Bulk
Type: Flux - No Clean, Lead Free
Form: Syringe, 0.18 oz (5g), 5cc
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 154 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 657.16 грн |
| SMD291NL75G |
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Виробник: Chip Quik Inc.
Description: FLUX - NO CLEAN LF CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: FLUX - NO CLEAN LF CAN 2.64 OZ
Packaging: Bulk
Type: Flux - No Clean, Lead Free, Tacky Solder
Form: Jar, 2.65 oz (75g)
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 10 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4465.94 грн |
| SMD291SNL |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN LF 5CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO-CLEAN LF 5CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 0.53 oz (15g), 5cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 157 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1052.85 грн |
| SMD291SNL10 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN 10CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO-CLEAN 10CC SYR
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 15 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1685.33 грн |
| SMD291SNL10T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE LF T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE LF T5 10CC
Packaging: Dispenser
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Syringe, 1.23 oz (35g), 10cc
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 45 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 2627.12 грн |
| SMD291SNL15T4 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE TWO PART MIX
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 0.53 oz (15g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
Description: SOLDER PASTE TWO PART MIX
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste, Two Part Mix
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 0.53 oz (15g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 77°F (3°C ~ 25°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 24 Months
на замовлення 14 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 1413.06 грн |
| SMD291SNL250T3 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 56 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4573.93 грн |
| SMD291SNL250T4 |
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Виробник: Chip Quik Inc.
Description: SLDR PST NO-CLEAN SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SLDR PST NO-CLEAN SAC305 T4 250G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 3 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 4992.76 грн |
| SMD291SNL250T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 250G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 8.8 oz (250g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD291SNL40T7 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE IN JAR 40G (T7) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.41 oz (40g)
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE IN JAR 40G (T7) SAC
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 1.41 oz (40g)
Mesh Type: 7
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD291SNL500T3 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD291SNL500T3C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE NO-CLEAN SAC305 T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE NO-CLEAN SAC305 T3
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 3
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD291SNL500T4C |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 T4 500G
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Cartridge, 17.64 oz (500g)
Mesh Type: 4
Process: Lead Free
Flux Type: No-Clean
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
товару немає в наявності
В кошику
од. на суму грн.
| SMD291SNL500T5 |
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Виробник: Chip Quik Inc.
Description: SOLDER PASTE SAC305 500G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
Description: SOLDER PASTE SAC305 500G T5
Packaging: Bulk
Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Type: Solder Paste
Melting Point: 423 ~ 428°F (217 ~ 220°C)
Form: Jar, 17.64 oz (500g)
Mesh Type: 5
Process: Lead Free
Flux Type: No-Clean
Part Status: Active
Storage/Refrigeration Temperature: 37°F ~ 46°F (3°C ~ 8°C)
Shelf Life Start: Date of Manufacture
Shelf Life: 6 Months
на замовлення 8 шт:
термін постачання 21-31 дні (днів)
| Кількість | Ціна без ПДВ |
|---|---|
| 1+ | 13137.13 грн |











































