Продукція > CHIP QUIK INC. > Всі товари виробника CHIP QUIK INC. (2420) > Сторінка 31 з 41
Фото | Назва | Виробник | Інформація |
Доступність |
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PA0186 | Chip Quik Inc. |
Description: TO-263-7 DDPAK/D2PAK TO DIP-14 Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 7 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Part Status: Active |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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PA0186-S | Chip Quik Inc. | Description: TO-263-7 STENCIL |
товар відсутній |
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PA0187 | Chip Quik Inc. |
Description: TO-263-9 DDPAK/D2PAK TO DIP-18 S Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 9 Pitch: 0.038" (0.97mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TO-263 (DDPAK/D2PAK) Part Status: Active |
товар відсутній |
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PA0187-S | Chip Quik Inc. |
Description: TO-263-9 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.038" (0.97mm) Type: TO/DDPAK Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm) Number of Positions: 9 |
товар відсутній |
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PA0188 | Chip Quik Inc. |
Description: LQFP-144 TO PGA-144 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.300" x 2.300" (58.42mm x 58.42mm) Material: FR4 Epoxy Glass Number of Positions: 144 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: LQFP Part Status: Active |
на замовлення 15 шт: термін постачання 21-31 дні (днів) |
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PA0188-S | Chip Quik Inc. |
Description: STENCIL TQFP-144 .5MM Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TQFP Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 144 |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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PA0189 | Chip Quik Inc. |
Description: LQFP-176 TO PGA-176 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm) Material: FR4 Epoxy Glass Number of Positions: 176 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: LQFP Part Status: Active |
на замовлення 1 шт: термін постачання 21-31 дні (днів) |
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PA0189-S | Chip Quik Inc. |
Description: LQFP-176 (0.5MM PITCH, 24X24MM B Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: LQFP Inner Dimension: 0.945" L x 0.945" W (24.00mm x 24.00mm) Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 176 |
товар відсутній |
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PA0190 | Chip Quik Inc. |
Description: TQFP-128 TO PGA-128 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.100" x 2.100" (53.34mm x 53.34mm) Material: FR4 Epoxy Glass Number of Positions: 128 Pitch: 0.016" (0.40mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: TQFP Part Status: Active |
товар відсутній |
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PA0190-S | Chip Quik Inc. |
Description: TQFP-128 (0.4MM PITCH, 14X14MM B Packaging: Bulk Material: Stainless Steel Pitch: 0.016" (0.40mm) Type: TQFP Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 128 |
товар відсутній |
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PA0191 | Chip Quik Inc. |
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT Packaging: Bulk Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm) Material: FR4 Epoxy Glass Number of Positions: 10 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP |
на замовлення 41 шт: термін постачання 21-31 дні (днів) |
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PA0191-S | Chip Quik Inc. |
Description: TSSOP-10-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm) Number of Positions: 10 |
товар відсутній |
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PA0192 | Chip Quik Inc. |
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT Packaging: Bulk Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm) Material: FR4 Epoxy Glass Number of Positions: 14 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
товар відсутній |
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PA0192-S | Chip Quik Inc. |
Description: TSSOP-14-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm) Number of Positions: 14 |
товар відсутній |
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PA0193 | Chip Quik Inc. |
Description: TSSOP-16-EXP-PAD TO DIP-16 SMT Packaging: Bulk Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 25 шт: термін постачання 21-31 дні (днів) |
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PA0193-S | Chip Quik Inc. |
Description: TSSOP-16-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm) Number of Positions: 16 |
товар відсутній |
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PA0194 | Chip Quik Inc. |
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 20 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 18 шт: термін постачання 21-31 дні (днів) |
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PA0194C | Chip Quik Inc. |
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A Packaging: Bulk Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm) Number of Positions: 20 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 21 шт: термін постачання 21-31 дні (днів) |
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PA0194-S | Chip Quik Inc. |
Description: TSSOP-20-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Inner Dimension: 0.256" L x 0.173" W (6.50mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Thermal Center Pad: 0.492" L x 0.118" W (12.50mm x 3.00mm) Number of Positions: 20 |
товар відсутній |
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PA0195 | Chip Quik Inc. |
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 57 шт: термін постачання 21-31 дні (днів) |
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PA0195C | Chip Quik Inc. |
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT A Packaging: Bulk Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm) Number of Positions: 28 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 33 шт: термін постачання 21-31 дні (днів) |
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PA0195C-N | Chip Quik Inc. |
Description: TSSOP-28-EXP-PAD TO DIP-28 NARRO Packaging: Bulk Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm) Number of Positions: 28 Pitch: 0.026" (0.65mm) Proto Board Type: SMD to DIP Package Accepted: TSSOP Part Status: Active |
на замовлення 46 шт: термін постачання 21-31 дні (днів) |
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PA0195-S | Chip Quik Inc. |
Description: TSSOP-28-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSSOP Inner Dimension: 0.382" L x 0.173" W (9.70mm x 4.40mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.630" L x 0.118" W (16.00mm x 3.00mm) Number of Positions: 28 |
товар відсутній |
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PA0196 | Chip Quik Inc. |
Description: TSSOP-64-EXP-PAD TO DIP-64 SMT Packaging: Bulk Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm) Material: FR4 Epoxy Glass Number of Positions: 64 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSSOP |
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PA0196-S | Chip Quik Inc. |
Description: TSSOP-64-EXP-PAD STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSSOP Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Thermal Center Pad: 0.906" L x 0.150" W (23.00mm x 3.81mm) Number of Positions: 64 |
товар відсутній |
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PA0200 | Chip Quik Inc. |
Description: PQFP-100 TO PGA-100 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm) Material: FR4 Epoxy Glass Number of Positions: 100 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: PQFP Part Status: Active |
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PA0201 | Chip Quik Inc. |
Description: PQFP-160 TO PGA-160 SMT ADAPTER Packaging: Bulk Size / Dimension: 2.500" L x 2.500" W (63.50mm x 63.50mm) Material: FR4 Epoxy Glass Number of Positions: 160 Pitch: 0.026" (0.65mm) Board Thickness: 0.063" (1.60mm) Proto Board Type: SMD to PGA Package Accepted: PQFP Part Status: Active |
на замовлення 7 шт: термін постачання 21-31 дні (днів) |
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PA0202 | Chip Quik Inc. | Description: QFP-208/QFP-208/RQFP-208 TO PGA |
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PA0202-S | Chip Quik Inc. | Description: QFP-208/QFP-208/RQFP-208 STENCI |
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PA0203 | Chip Quik Inc. |
Description: LQFP-112 TO PGA-112 ADAPTER Packaging: Bulk Size / Dimension: 1.800" x 1.800" (45.72mm x 45.72mm) Material: FR4 Epoxy Glass Number of Positions: 112 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to PGA Package Accepted: LQFP Part Status: Active |
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PA0203-S | Chip Quik Inc. | Description: LQFP-112 STENCIL |
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PA0206 | Chip Quik Inc. |
Description: DFN-16-EXP-PAD TO DIP-20 SMT Packaging: Bulk Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm) Material: FR4 Epoxy Glass Number of Positions: 16 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: DFN Part Status: Active |
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PA0206-S | Chip Quik Inc. | Description: DFN-16 STENCIL |
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PA0207 | Chip Quik Inc. |
Description: TSOP-40 I TO DIP-40 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm) Material: FR4 Epoxy Glass Number of Positions: 40 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
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PA0207-S | Chip Quik Inc. |
Description: TSOP-40 I STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSOP Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 40 |
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PA0208 | Chip Quik Inc. |
Description: TSOP-48 I TO DIP-48 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm) Material: FR4 Epoxy Glass Number of Positions: 48 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
на замовлення 9 шт: термін постачання 21-31 дні (днів) |
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PA0208C | Chip Quik Inc. |
Description: TSOP-48 (I) TO DIP-48 SMT ADAPTE Packaging: Bulk Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm) Number of Positions: 48 Pitch: 0.020" (0.50mm) Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
на замовлення 44 шт: термін постачання 21-31 дні (днів) |
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PA0208-S | Chip Quik Inc. |
Description: TSOP-48 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSOP Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 48 |
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PA0209 | Chip Quik Inc. |
Description: TSOP-50 II TO DIP-50 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm) Material: FR4 Epoxy Glass Number of Positions: 50 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
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PA0209-S | Chip Quik Inc. |
Description: TSOP-50 II STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 50 |
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PA0210 | Chip Quik Inc. |
Description: TSOP-54 II TO DIP-54 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm) Material: FR4 Epoxy Glass Number of Positions: 54 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
на замовлення 20 шт: термін постачання 21-31 дні (днів) |
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PA0210C | Chip Quik Inc. |
Description: TSOP-54 (II) TO DIP-54 SMT ADAPT Packaging: Bulk Size / Dimension: 2.700" L x 0.700" W (68.58mm x 17.78mm) Number of Positions: 54 Pitch: 0.031" (0.80mm) Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
на замовлення 64 шт: термін постачання 21-31 дні (днів) |
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PA0210-S | Chip Quik Inc. |
Description: TSOP-54 II STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 54 |
товар відсутній |
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PA0211 | Chip Quik Inc. |
Description: TSOP-56 I TO DIP-56 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm) Material: FR4 Epoxy Glass Number of Positions: 56 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
на замовлення 11 шт: термін постачання 21-31 дні (днів) |
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PA0211-S | Chip Quik Inc. |
Description: TSOP-56 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSOP Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm) Part Status: Active Number of Positions: 56 |
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PA0212 | Chip Quik Inc. |
Description: TSOP-66 II TO DIP-66 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm) Material: FR4 Epoxy Glass Number of Positions: 66 Pitch: 0.026" (0.65mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
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PA0212-S | Chip Quik Inc. |
Description: TSOP-66 II STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.026" (0.65mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 66 |
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PA0213 | Chip Quik Inc. |
Description: TSOP-86 II TO DIP-86 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 4.300" (25.40mm x 109.22mm) Material: FR4 Epoxy Glass Number of Positions: 86 Pitch: 0.020" (0.50mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
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PA0213-S | Chip Quik Inc. |
Description: TSOP-86 II STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.020" (0.50mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 86 |
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PA0214 | Chip Quik Inc. |
Description: PLCC-32/LCC-32/JLCC-32 TO DIP-32 Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
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PA0214C | Chip Quik Inc. |
Description: PLCC-32 TO DIP-32 SMT ADAPTER (5 Packaging: Bulk Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm) Number of Positions: 32 Pitch: 0.050" (1.27mm) Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 23 шт: термін постачання 21-31 дні (днів) |
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PA0214-S | Chip Quik Inc. |
Description: PLCC-32 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: PLCC/JLCC Inner Dimension: 0.551" L x 0.453" W (14.00mm x 11.50mm) Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 32 |
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PA0214SOCKET | Chip Quik Inc. |
Description: PLCC-32 SOCKET TO DIP-32 ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
на замовлення 88 шт: термін постачання 21-31 дні (днів) |
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PA0216 | Chip Quik Inc. |
Description: TSOP-32 II TO DIP-32 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm) Material: FR4 Epoxy Glass Number of Positions: 32 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
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PA0216-S | Chip Quik Inc. |
Description: TSOP-32 II STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.050" (1.27mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 32 |
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PA0217 | Chip Quik Inc. |
Description: TSOP-44 II TO DIP-44 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm) Material: FR4 Epoxy Glass Number of Positions: 44 Pitch: 0.031" (0.80mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP Part Status: Active |
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PA0217-S | Chip Quik Inc. |
Description: TSOP-44 II STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.031" (0.80mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Part Status: Active Number of Positions: 44 |
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PA0218 | Chip Quik Inc. |
Description: TSOP-28 I TO DIP-28 SMT ADAPTER Packaging: Bulk Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm) Material: FR4 Epoxy Glass Number of Positions: 28 Pitch: 0.022" (0.55mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: TSOP |
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PA0218-S | Chip Quik Inc. |
Description: TSOP-28 STENCIL Packaging: Bulk Material: Stainless Steel Pitch: 0.022" (0.55mm) Type: TSOP Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm) Number of Positions: 28 |
товар відсутній |
||||
PA0219 | Chip Quik Inc. |
Description: PLCC-52/LCC-52/JLCC-52 TO DIP-52 Packaging: Bulk Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm) Material: FR4 Epoxy Glass Number of Positions: 52 Pitch: 0.050" (1.27mm) Board Thickness: 0.062" (1.57mm) 1/16" Proto Board Type: SMD to DIP Package Accepted: LCC, JLCC, PLCC Part Status: Active |
товар відсутній |
PA0186 |
Виробник: Chip Quik Inc.
Description: TO-263-7 DDPAK/D2PAK TO DIP-14
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Description: TO-263-7 DDPAK/D2PAK TO DIP-14
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 7
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 356.25 грн |
PA0187 |
Виробник: Chip Quik Inc.
Description: TO-263-9 DDPAK/D2PAK TO DIP-18 S
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 9
Pitch: 0.038" (0.97mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
Description: TO-263-9 DDPAK/D2PAK TO DIP-18 S
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 9
Pitch: 0.038" (0.97mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TO-263 (DDPAK/D2PAK)
Part Status: Active
товар відсутній
PA0187-S |
Виробник: Chip Quik Inc.
Description: TO-263-9 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: TO/DDPAK
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm)
Number of Positions: 9
Description: TO-263-9 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.038" (0.97mm)
Type: TO/DDPAK
Inner Dimension: 0.400" L x 0.390" W (10.16mm x 9.91mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.427" L x 0.370" W (10.85mm x 9.40mm)
Number of Positions: 9
товар відсутній
PA0188 |
Виробник: Chip Quik Inc.
Description: LQFP-144 TO PGA-144 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.300" x 2.300" (58.42mm x 58.42mm)
Material: FR4 Epoxy Glass
Number of Positions: 144
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
Description: LQFP-144 TO PGA-144 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.300" x 2.300" (58.42mm x 58.42mm)
Material: FR4 Epoxy Glass
Number of Positions: 144
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
на замовлення 15 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1116.21 грн |
PA0188-S |
Виробник: Chip Quik Inc.
Description: STENCIL TQFP-144 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 144
Description: STENCIL TQFP-144 .5MM
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TQFP
Inner Dimension: 0.787" L x 0.787" W (20.00mm x 20.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 144
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 781.13 грн |
PA0189 |
Виробник: Chip Quik Inc.
Description: LQFP-176 TO PGA-176 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 176
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
Description: LQFP-176 TO PGA-176 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.700" x 2.700" (68.58mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 176
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
на замовлення 1 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1113.29 грн |
PA0189-S |
Виробник: Chip Quik Inc.
Description: LQFP-176 (0.5MM PITCH, 24X24MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LQFP
Inner Dimension: 0.945" L x 0.945" W (24.00mm x 24.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 176
Description: LQFP-176 (0.5MM PITCH, 24X24MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: LQFP
Inner Dimension: 0.945" L x 0.945" W (24.00mm x 24.00mm)
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 176
товар відсутній
PA0190 |
Виробник: Chip Quik Inc.
Description: TQFP-128 TO PGA-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.100" x 2.100" (53.34mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: TQFP
Part Status: Active
Description: TQFP-128 TO PGA-128 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.100" x 2.100" (53.34mm x 53.34mm)
Material: FR4 Epoxy Glass
Number of Positions: 128
Pitch: 0.016" (0.40mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: TQFP
Part Status: Active
товар відсутній
PA0190-S |
Виробник: Chip Quik Inc.
Description: TQFP-128 (0.4MM PITCH, 14X14MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 128
Description: TQFP-128 (0.4MM PITCH, 14X14MM B
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.016" (0.40mm)
Type: TQFP
Inner Dimension: 0.551" L x 0.551" W (14.00mm x 14.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 128
товар відсутній
PA0191 |
Виробник: Chip Quik Inc.
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Description: TSSOP-10-EXP-PAD TO DIP-10 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.500" (17.78mm x 12.70 mm)
Material: FR4 Epoxy Glass
Number of Positions: 10
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
на замовлення 41 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
2+ | 286.17 грн |
PA0191-S |
Виробник: Chip Quik Inc.
Description: TSSOP-10-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm)
Number of Positions: 10
Description: TSSOP-10-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.118" L x 0.118" W (3.00mm x 3.00mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.354" L x 0.069" W (9.00mm x 1.75mm)
Number of Positions: 10
товар відсутній
PA0192 |
Виробник: Chip Quik Inc.
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-14-EXP-PAD TO DIP-14 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.700" (17.78mm x 17.78mm)
Material: FR4 Epoxy Glass
Number of Positions: 14
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
товар відсутній
PA0192-S |
Виробник: Chip Quik Inc.
Description: TSSOP-14-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 14
Description: TSSOP-14-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 14
товар відсутній
PA0193 |
Виробник: Chip Quik Inc.
Description: TSSOP-16-EXP-PAD TO DIP-16 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-16-EXP-PAD TO DIP-16 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 0.800" (17.78mm x 20.32mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 25 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 361.36 грн |
PA0193-S |
Виробник: Chip Quik Inc.
Description: TSSOP-16-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 16
Description: TSSOP-16-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.197" L x 0.173" W (5.00mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.433" L x 0.118" W (11.00mm x 3.00mm)
Number of Positions: 16
товар відсутній
PA0194 |
Виробник: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 18 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 395.67 грн |
PA0194C |
Виробник: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-20-EXP-PAD TO DIP-20 SMT A
Packaging: Bulk
Size / Dimension: 1.000" L x 0.400" W (25.40mm x 10.16mm)
Number of Positions: 20
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 21 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 600.81 грн |
PA0194-S |
Виробник: Chip Quik Inc.
Description: TSSOP-20-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.256" L x 0.173" W (6.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.492" L x 0.118" W (12.50mm x 3.00mm)
Number of Positions: 20
Description: TSSOP-20-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.256" L x 0.173" W (6.50mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Thermal Center Pad: 0.492" L x 0.118" W (12.50mm x 3.00mm)
Number of Positions: 20
товар відсутній
PA0195 |
Виробник: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 57 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 470.87 грн |
PA0195C |
Виробник: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT A
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-28-EXP-PAD TO DIP-28 SMT A
Packaging: Bulk
Size / Dimension: 1.400" L x 0.700" W (35.56mm x 17.78mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 33 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 676.01 грн |
PA0195C-N |
Виробник: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD TO DIP-28 NARRO
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
Description: TSSOP-28-EXP-PAD TO DIP-28 NARRO
Packaging: Bulk
Size / Dimension: 1.400" L x 0.400" W (35.56mm x 10.16mm)
Number of Positions: 28
Pitch: 0.026" (0.65mm)
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Part Status: Active
на замовлення 46 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 676.01 грн |
PA0195-S |
Виробник: Chip Quik Inc.
Description: TSSOP-28-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.382" L x 0.173" W (9.70mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.118" W (16.00mm x 3.00mm)
Number of Positions: 28
Description: TSSOP-28-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSSOP
Inner Dimension: 0.382" L x 0.173" W (9.70mm x 4.40mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.630" L x 0.118" W (16.00mm x 3.00mm)
Number of Positions: 28
товар відсутній
PA0196 |
Виробник: Chip Quik Inc.
Description: TSSOP-64-EXP-PAD TO DIP-64 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
Description: TSSOP-64-EXP-PAD TO DIP-64 SMT
Packaging: Bulk
Size / Dimension: 1.000" x 3.200" (25.40mm x 81.28mm)
Material: FR4 Epoxy Glass
Number of Positions: 64
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSSOP
товар відсутній
PA0196-S |
Виробник: Chip Quik Inc.
Description: TSSOP-64-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.906" L x 0.150" W (23.00mm x 3.81mm)
Number of Positions: 64
Description: TSSOP-64-EXP-PAD STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSSOP
Inner Dimension: 0.669" L x 0.240" W (17.00mm x 6.10mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Thermal Center Pad: 0.906" L x 0.150" W (23.00mm x 3.81mm)
Number of Positions: 64
товар відсутній
PA0200 |
Виробник: Chip Quik Inc.
Description: PQFP-100 TO PGA-100 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PQFP
Part Status: Active
Description: PQFP-100 TO PGA-100 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.700" L x 1.700" W (43.18mm x 43.18mm)
Material: FR4 Epoxy Glass
Number of Positions: 100
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PQFP
Part Status: Active
товар відсутній
PA0201 |
Виробник: Chip Quik Inc.
Description: PQFP-160 TO PGA-160 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.500" L x 2.500" W (63.50mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 160
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PQFP
Part Status: Active
Description: PQFP-160 TO PGA-160 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 2.500" L x 2.500" W (63.50mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 160
Pitch: 0.026" (0.65mm)
Board Thickness: 0.063" (1.60mm)
Proto Board Type: SMD to PGA
Package Accepted: PQFP
Part Status: Active
на замовлення 7 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1113.29 грн |
PA0203 |
Виробник: Chip Quik Inc.
Description: LQFP-112 TO PGA-112 ADAPTER
Packaging: Bulk
Size / Dimension: 1.800" x 1.800" (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 112
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
Description: LQFP-112 TO PGA-112 ADAPTER
Packaging: Bulk
Size / Dimension: 1.800" x 1.800" (45.72mm x 45.72mm)
Material: FR4 Epoxy Glass
Number of Positions: 112
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to PGA
Package Accepted: LQFP
Part Status: Active
товар відсутній
PA0206 |
Виробник: Chip Quik Inc.
Description: DFN-16-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
Description: DFN-16-EXP-PAD TO DIP-20 SMT
Packaging: Bulk
Size / Dimension: 0.700" x 1.000" (17.78mm x 25.40mm)
Material: FR4 Epoxy Glass
Number of Positions: 16
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: DFN
Part Status: Active
товар відсутній
PA0207 |
Виробник: Chip Quik Inc.
Description: TSOP-40 I TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-40 I TO DIP-40 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.000" (25.40mm x 50.80mm)
Material: FR4 Epoxy Glass
Number of Positions: 40
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0207-S |
Виробник: Chip Quik Inc.
Description: TSOP-40 I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 40
Description: TSOP-40 I STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 40
товар відсутній
PA0208 |
Виробник: Chip Quik Inc.
Description: TSOP-48 I TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-48 I TO DIP-48 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.400" (25.40mm x 60.96mm)
Material: FR4 Epoxy Glass
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 9 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 565.77 грн |
PA0208C |
Виробник: Chip Quik Inc.
Description: TSOP-48 (I) TO DIP-48 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-48 (I) TO DIP-48 SMT ADAPTE
Packaging: Bulk
Size / Dimension: 2.400" L x 0.700" W (60.96mm x 17.78mm)
Number of Positions: 48
Pitch: 0.020" (0.50mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 44 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 767.99 грн |
PA0208-S |
Виробник: Chip Quik Inc.
Description: TSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 48
Description: TSOP-48 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 48
товар відсутній
PA0209 |
Виробник: Chip Quik Inc.
Description: TSOP-50 II TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-50 II TO DIP-50 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.500" (25.40mm x 63.50mm)
Material: FR4 Epoxy Glass
Number of Positions: 50
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0209-S |
Виробник: Chip Quik Inc.
Description: TSOP-50 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 50
Description: TSOP-50 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 50
товар відсутній
PA0210 |
Виробник: Chip Quik Inc.
Description: TSOP-54 II TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-54 II TO DIP-54 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.700" (25.40mm x 68.58mm)
Material: FR4 Epoxy Glass
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 20 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 639.5 грн |
PA0210C |
Виробник: Chip Quik Inc.
Description: TSOP-54 (II) TO DIP-54 SMT ADAPT
Packaging: Bulk
Size / Dimension: 2.700" L x 0.700" W (68.58mm x 17.78mm)
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-54 (II) TO DIP-54 SMT ADAPT
Packaging: Bulk
Size / Dimension: 2.700" L x 0.700" W (68.58mm x 17.78mm)
Number of Positions: 54
Pitch: 0.031" (0.80mm)
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 64 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 841.72 грн |
PA0210-S |
Виробник: Chip Quik Inc.
Description: TSOP-54 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 54
Description: TSOP-54 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 54
товар відсутній
PA0211 |
Виробник: Chip Quik Inc.
Description: TSOP-56 I TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-56 I TO DIP-56 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.800" (25.40mm x 71.12mm)
Material: FR4 Epoxy Glass
Number of Positions: 56
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
на замовлення 11 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 648.99 грн |
PA0211-S |
Виробник: Chip Quik Inc.
Description: TSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 56
Description: TSOP-56 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.950" L x 1.350" W (49.53mm x 34.29mm)
Part Status: Active
Number of Positions: 56
товар відсутній
PA0212 |
Виробник: Chip Quik Inc.
Description: TSOP-66 II TO DIP-66 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm)
Material: FR4 Epoxy Glass
Number of Positions: 66
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: TSOP-66 II TO DIP-66 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 3.300" (25.40mm x 83.82mm)
Material: FR4 Epoxy Glass
Number of Positions: 66
Pitch: 0.026" (0.65mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
товар відсутній
PA0212-S |
Виробник: Chip Quik Inc.
Description: TSOP-66 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 66
Description: TSOP-66 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.026" (0.65mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 66
товар відсутній
PA0213 |
Виробник: Chip Quik Inc.
Description: TSOP-86 II TO DIP-86 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 4.300" (25.40mm x 109.22mm)
Material: FR4 Epoxy Glass
Number of Positions: 86
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-86 II TO DIP-86 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 4.300" (25.40mm x 109.22mm)
Material: FR4 Epoxy Glass
Number of Positions: 86
Pitch: 0.020" (0.50mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0213-S |
Виробник: Chip Quik Inc.
Description: TSOP-86 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 86
Description: TSOP-86 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.020" (0.50mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 86
товар відсутній
PA0214 |
Виробник: Chip Quik Inc.
Description: PLCC-32/LCC-32/JLCC-32 TO DIP-32
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-32/LCC-32/JLCC-32 TO DIP-32
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
товар відсутній
PA0214C |
Виробник: Chip Quik Inc.
Description: PLCC-32 TO DIP-32 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-32 TO DIP-32 SMT ADAPTER (5
Packaging: Bulk
Size / Dimension: 1.600" L x 0.700" W (40.64mm x 17.78mm)
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 23 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1065.84 грн |
PA0214-S |
Виробник: Chip Quik Inc.
Description: PLCC-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.551" L x 0.453" W (14.00mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
Description: PLCC-32 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: PLCC/JLCC
Inner Dimension: 0.551" L x 0.453" W (14.00mm x 11.50mm)
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 32
товар відсутній
PA0214SOCKET |
Виробник: Chip Quik Inc.
Description: PLCC-32 SOCKET TO DIP-32 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-32 SOCKET TO DIP-32 ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
на замовлення 88 шт:
термін постачання 21-31 дні (днів)Кількість | Ціна без ПДВ |
---|---|
1+ | 1222.8 грн |
PA0216 |
Виробник: Chip Quik Inc.
Description: TSOP-32 II TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-32 II TO DIP-32 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.600" (25.40mm x 40.64mm)
Material: FR4 Epoxy Glass
Number of Positions: 32
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0216-S |
Виробник: Chip Quik Inc.
Description: TSOP-32 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
Description: TSOP-32 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.050" (1.27mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 32
товар відсутній
PA0217 |
Виробник: Chip Quik Inc.
Description: TSOP-44 II TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
Description: TSOP-44 II TO DIP-44 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 2.200" (25.40mm x 55.88mm)
Material: FR4 Epoxy Glass
Number of Positions: 44
Pitch: 0.031" (0.80mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Part Status: Active
товар відсутній
PA0217-S |
Виробник: Chip Quik Inc.
Description: TSOP-44 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
Description: TSOP-44 II STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.031" (0.80mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Part Status: Active
Number of Positions: 44
товар відсутній
PA0218 |
Виробник: Chip Quik Inc.
Description: TSOP-28 I TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
Description: TSOP-28 I TO DIP-28 SMT ADAPTER
Packaging: Bulk
Size / Dimension: 1.000" x 1.400" (25.40mm x 35.56mm)
Material: FR4 Epoxy Glass
Number of Positions: 28
Pitch: 0.022" (0.55mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: TSOP
товар відсутній
PA0218-S |
Виробник: Chip Quik Inc.
Description: TSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
Description: TSOP-28 STENCIL
Packaging: Bulk
Material: Stainless Steel
Pitch: 0.022" (0.55mm)
Type: TSOP
Outer Dimension: 1.300" L x 0.900" W (33.02mm x 22.86mm)
Number of Positions: 28
товар відсутній
PA0219 |
Виробник: Chip Quik Inc.
Description: PLCC-52/LCC-52/JLCC-52 TO DIP-52
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
Description: PLCC-52/LCC-52/JLCC-52 TO DIP-52
Packaging: Bulk
Size / Dimension: 1.000" x 2.600" (25.40mm x 66.04mm)
Material: FR4 Epoxy Glass
Number of Positions: 52
Pitch: 0.050" (1.27mm)
Board Thickness: 0.062" (1.57mm) 1/16"
Proto Board Type: SMD to DIP
Package Accepted: LCC, JLCC, PLCC
Part Status: Active
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